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SN74HC157PWTG4

Texas Instruments

SN74HC157PWTG4 by Texas Instruments

SN74HC157PWTG4 by Texas Instruments is a CMOS multiplexer with 2 inputs and 4 functions. It has a propagation delay of 32 ns at 5V, making it suitable for industrial applications requiring fast switching. With a small outline package style and surface mount capability, it offers versatility in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,461 parts In-Stock

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Digiode

USA . 2,330 parts In-Stock

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Parana Technologies

USA . 1,387 parts In-Stock

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$10.169

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$10.709

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$10.169

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$10.709

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DigiPath Technology Company

USA . 752 parts In-Stock

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$11.197

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$10.302

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752

$11.197

$10.302

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ChromeModa Solutions

Germany . 4,401 parts In-Stock

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$11.426

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$9.369

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$11.426

$9.369

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IDEA Electronic Components Group

UK . 770 parts In-Stock

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$11.426

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$10.855

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$10.283

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770

$11.426

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$10.283

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AZTECH Wire

Italy . 838 parts In-Stock

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$11.937

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838

$11.937

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One Stop Electronics

USA . 1,641 parts In-Stock

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$64.000

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QUARKTWIN TECHNOLOGY LTD

USA . 14,776 parts In-Stock

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Microchip USA

USA . 2,075 parts In-Stock

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Corphita

USA . 1,558 parts In-Stock

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GreenTree Electronics

Israel . 250 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 134 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality SN74HC157PWTG4 multiplexer & demultiplexer by Texas Instruments. Designed with precision and reliability in mind, this versatile component allows for seamless signal routing in a compact and durable package. With fast propagation delay and low power consumption, this product offers exceptional performance while maximizing efficiency. Whether you're building circuits for industrial automation or consumer electronics, the SN74HC157PWTG4 provides unmatched value and flexibility to meet your project requirements. Trust Texas Instruments for cutting-edge solutions that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 32 ns

Low propagation delay ensures fast data processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

No. of Functions: 4

This multiplexer/demultiplexer can handle multiple functions, offering versatility in data routing and processing.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with various power supplies.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments with varying conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the reliability of the product.

Technical Specifications

Multiplexer & Demultiplexer SN74HC157PWTG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

235 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74HC157PWTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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