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SN74HC139DRG4

Texas Instruments

SN74HC139DRG4 by Texas Instruments

SN74HC139DRG4 by Texas Instruments is a CMOS Decoder & Drivers with 2 functions, 44 ns propagation delay at 5V. It has inverted output polarity and operates in industrial temperature range. Ideal for applications requiring standard input conditioning and surface mount compatibility.

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4

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1k+

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Chip Stock

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Digiode

USA . 3,503 parts In-Stock

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Bristol Electronics

USA . 3,157 parts In-Stock

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Vyrian

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One Stop Electronics

USA . 816 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 448 parts In-Stock

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$18.520

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Parana Technologies

USA . 1,128 parts In-Stock

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$24.511

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DigiPath Technology Company

USA . 528 parts In-Stock

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$26.989

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$24.830

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ChromeModa Solutions

Germany . 2,574 parts In-Stock

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$27.540

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$22.583

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IDEA Electronic Components Group

UK . 476 parts In-Stock

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$24.786

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Corphita

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Overview

Unlock the power of efficient decoding and driving with the Texas Instruments SN74HC139DRG4. Designed with high-quality materials and advanced technology, this decoder & drivers product offers reliable performance in a compact package. Perfect for industrial applications, this versatile component provides inverted output polarity and dual terminal position for seamless integration into your projects. Experience the value and benefits of Texas Instruments' innovation with the SN74HC139DRG4 - the key to optimizing your systems with precision and ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the decoder & driver.

Propagation Delay At Nominal Supply: 44 ns

Low propagation delay ensures quick and efficient signal processing in the decoder & driver.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into electronic circuits.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of signal inputs.

No. of Functions: 2

Having multiple functions in one device increases efficiency and saves space in the circuit design.

No. of Bits: 4

4 bits provide sufficient resolution for decoding and driving signals in various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at 5V nominal supply voltage allows for compatibility with common power sources.

Load Capacitance (CL): 50 pF

The low load capacitance ensures stable and reliable operation in different circuit configurations.

Power Supplies (V): 2/6

Support for dual power supplies (2V and 6V) provides flexibility in power management.

Maximum I (ol): 5.2 Amp

High output current capability allows for driving power-hungry components in the circuit.

Propagation Delay (tpd): 220 ns

Low propagation delay ensures quick response and efficient signal processing in the decoder & driver.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Excellent temperature range allows for reliable operation in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides corrosion resistance and ensures reliable electrical connections.

Maximum Supply Voltage (Vsup): 6 V

Support for up to 6V supply voltage allows for compatibility with a range of power sources.

Technical Specifications

Decoder & Drivers SN74HC139DRG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

HC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

44 ns

Propagation Delay (tpd):

220 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HC139DRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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