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SN74F258DR

Texas Instruments

SN74F258DR by Texas Instruments

SN74F258DR by Texas Instruments is a 4-function multiplexer with 2 inputs, operating at a supply voltage of 5V. It features a propagation delay of 11ns and output characteristics in 3-STATE. This TTL technology device is ideal for applications requiring high-speed signal switching in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,611 parts In-Stock

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Microfarads

USA . 2,523 parts In-Stock

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Digiode

USA . 2,500 parts In-Stock

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Sea View Technologies

USA . 2,037 parts In-Stock

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Bristol Electronics

USA . 2,037 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,297 parts In-Stock

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$14.397

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$14.838

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$14.838

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AZTECH Wire

Italy . 276 parts In-Stock

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$15.359

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IDEA Electronic Components Group

UK . 1,239 parts In-Stock

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$16.176

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$15.367

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$14.558

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$14.558

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ChromeModa Solutions

Germany . 640 parts In-Stock

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$16.176

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$13.264

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One Stop Electronics

USA . 452 parts In-Stock

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$47.000

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Perfect Parts

USA . 5,600 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,824 parts In-Stock

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Corphita

USA . 4,564 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,500 parts In-Stock

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DigiPath Technology Company

USA . 2,015 parts In-Stock

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$14.584

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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Microchip USA

USA . 295 parts In-Stock

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Overview

Unlock the power of advanced signal processing with the SN74F258DR by Texas Instruments. Manufactured with precision and expertise, this multiplexer/demultiplexer offers unmatched quality and reliability. Ideal for a wide range of applications, this versatile component provides exceptional performance and efficiency. Experience seamless integration and enhanced functionality with this innovative product, designed to exceed your expectations. Trust Texas Instruments for all your electronic needs and elevate your projects to new heights with the SN74F258DR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring longevity and reliability of the product.

Propagation Delay At Nominal Supply: 11 ns

Fast propagation delay allows for quick signal processing and efficient operation.

Surface Mount: YES

Easy installation onto circuit boards, saving time and effort during production.

No. of Functions: 4

Allows for multiple functions to be performed by a single component, reducing the need for additional parts.

No. of Inputs: 2

Efficiently handles data from multiple sources, enhancing versatility and usability.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common voltage level, ensuring compatibility with standard power sources.

Load Capacitance (CL): 50 pF

Well-matched capacitance for effective signal transmission and reception.

Power Supplies (V): 5

Consistent power supply for stable performance and reliable operation.

No. of Terminals: 16

Sufficient terminals for connecting to various components and circuits.

Maximum I (ol): 24 Amp

High output current capability for handling demanding applications.

Output Characteristics: 3-STATE

Provides the ability to drive outputs in three states, enhancing flexibility in signal control.

Width: 3.9 mm

Compact size for efficient use of space on circuit boards.

Output Polarity: INVERTED

Supports inverted output signals, expanding compatibility with different systems.

Technical Specifications

Multiplexer & Demultiplexer SN74F258DR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

23 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74F258DR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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