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SN74F151BDRG4

Texas Instruments

SN74F151BDRG4 by Texas Instruments

SN74F151BDRG4 by Texas Instruments is an 8-input multiplexer with a propagation delay of 9.5 ns at 5V supply, featuring a small outline package and 3-state output characteristics. Ideal for applications requiring fast signal switching in commercial temperature environments.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 3,902 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 323 parts In-Stock

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$8.079

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Parana Technologies

USA . 487 parts In-Stock

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DigiPath Technology Company

USA . 2,035 parts In-Stock

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ChromeModa Solutions

Germany . 3,303 parts In-Stock

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IDEA Electronic Components Group

UK . 1,551 parts In-Stock

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$10.479

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One Stop Electronics

USA . 1,218 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Corphita

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Overview

Upgrade your electronic designs with the SN74F151BDRG4 by Texas Instruments, a high-quality multiplexer & demultiplexer that offers unparalleled performance and reliability. Texas Instruments is known for producing top-notch components, and this product is no exception. With a fast propagation delay of 9.5ns and 3-STATE output characteristics, this device is perfect for applications requiring precise data routing and selection. Its compact size and surface mount option make it ideal for space-constrained designs. Trust in Texas Instruments to provide you with the cutting-edge technology you need to bring your projects to life efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and good resistance to environmental factors, making the product suitable for a variety of applications.

Propagation Delay At Nominal Supply: 9.5 ns

Low propagation delay ensures fast data transmission, making the product efficient for high-speed operations.

Surface Mount: YES

Surface mount capability enables easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Inputs: 8

Having 8 inputs allows for multiplexing or demultiplexing multiple data streams, increasing the versatility of the product.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with common power sources and simplifies integration into existing systems.

Load Capacitance (CL): 50 pF

With a manageable load capacitance of 50 pF, the product can drive specified loads without signal degradation or performance issues.

Power Supplies (V): 5

Consistent power supply voltage of 5V ensures stability and reliable performance of the multiplexer/demultiplexer.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options and flexibility for interfacing with other components in a circuit.

Maximum I (ol): 20 Amp

High output current capacity of 20 Amps allows the product to drive heavy loads or multiple devices without overheating or voltage drop issues.

Temperature Grade: COMMERCIAL

Commercial-grade temperature range of 0-70°C ensures reliable operation in standard environmental conditions typically encountered in commercial applications.

Technical Specifications

Multiplexer & Demultiplexer SN74F151BDRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

21 mA

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74F151BDRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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