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SN74AUC2G79DCURE4

Texas Instruments

SN74AUC2G79DCURE4 by Texas Instruments

SN74AUC2G79DCURE4 by Texas Instruments is a latches & flip-flops IC with 3.9 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 1.2V, has a load capacitance of 15pF, and can handle max frequency of 275MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,682 parts In-Stock

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7,682

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Digiode

USA . 4,219 parts In-Stock

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4,219

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Distributors (Availability)

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Parana Technologies

USA . 72 parts In-Stock

1+ parts

$17.808

100+ parts

-

1k+ parts

$17.987

10k+ parts

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72

$17.808

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$17.987

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AZTECH Wire

Italy . 699 parts In-Stock

1+ parts

$19.552

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-

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699

$19.552

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DigiPath Technology Company

USA . 1,317 parts In-Stock

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$19.609

100+ parts

$18.040

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-

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1,317

$19.609

$18.040

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ChromeModa Solutions

Germany . 6,112 parts In-Stock

1+ parts

$20.009

100+ parts

$16.407

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6,112

$20.009

$16.407

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IDEA Electronic Components Group

UK . 474 parts In-Stock

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$20.009

100+ parts

$19.009

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$18.008

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474

$20.009

$19.009

$18.008

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One Stop Electronics

USA . 637 parts In-Stock

1+ parts

$61.000

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637

$61.000

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Microchip USA

USA . 274 parts In-Stock

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274

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Corphita

USA . 192 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the SN74AUC2G79DCURE4 by Texas Instruments, a leading manufacturer in the industry. This innovative latch & flip-flop device offers lightning-fast 3.9 ns propagation delay, making it ideal for high-speed applications. With a compact small outline package and dual terminal position, this product is versatile and easy to integrate into your designs. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protects the internal components of the latch/flip-flop.

Propagation Delay At Nominal Supply: 3.9 ns

The low propagation delay ensures fast switching speeds, making this latch/flip-flop suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation onto circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 1.2

The low nominal supply voltage of 1.2V makes this latch/flip-flop energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and performance in a wide range of environmental conditions.

Technical Specifications

Latches & Flip-Flops SN74AUC2G79DCURE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

200000000 Hz

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

275 MHz

Trade Compliance

SN74AUC2G79DCURE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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