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SN74AS175BDRG4

Texas Instruments

SN74AS175BDRG4 by Texas Instruments

The Texas Instruments SN74AS175BDRG4 is a 4-bit latch with a propagation delay of 10 ns, operating at a supply voltage of 5V. It features positive edge triggering and operates within a temperature range of 0 to 70°C. Ideal for applications requiring fast data storage and retrieval in commercial-grade electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,816 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Digiode

USA . 158 parts In-Stock

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158

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AZTECH Wire

Italy . 218 parts In-Stock

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$16.972

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$16.972

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Corohmni

South Africa . 1,059 parts In-Stock

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$20.876

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One Stop Electronics

USA . 850 parts In-Stock

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$22.000

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Parana Technologies

USA . 1,282 parts In-Stock

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$22.196

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$22.842

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$22.842

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DigiPath Technology Company

USA . 503 parts In-Stock

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$24.440

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503

$24.440

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ChromeModa Solutions

Germany . 4,567 parts In-Stock

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$24.939

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$20.450

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IDEA Electronic Components Group

UK . 315 parts In-Stock

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$24.939

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$23.692

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$22.445

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315

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$22.445

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Ampacity Inc.

Singapore . 1,311 parts In-Stock

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$61.000

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Argo Parts USA

USA . 3,006 parts In-Stock

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Corphita

USA . 1,629 parts In-Stock

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Continental Prestige Electronics

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Aranea Global

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Microchip USA

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Overview

Unleash the power of seamless data storage and retrieval with the SN74AS175BDRG4 from Texas Instruments. Crafted with precision and expertise, this latches & flip-flops device offers unparalleled reliability and performance. Ideal for a wide range of applications, this product delivers swift and accurate results with a nominal supply voltage of 5V. Whether you're a tech enthusiast or a professional seeking top-notch components, this small outline package with dual terminal position and positive edge trigger type is sure to exceed your expectations. Upgrade your projects today with the innovative technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy is a durable and lightweight material, making the latch and flip-flop sturdy and suitable for various applications.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, saving space on a PCB and allowing for efficient assembly.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with common electronic systems and devices.

Propagation Delay (tpd): 10 ns

With a fast propagation delay of 10 nanoseconds, this latch and flip-flop can quickly respond to input changes, ensuring efficient performance.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control over when the latch or flip-flop captures new data, enhancing reliability and accuracy in data processing.

Technology: TTL

Uses TTL (Transistor-Transistor Logic) technology, known for its high-speed performance and reliability in digital circuits.

Technical Specifications

Latches & Flip-Flops SN74AS175BDRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AS

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

100 MHz

Trade Compliance

SN74AS175BDRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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