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SN74ALS273DWRG4

Texas Instruments

SN74ALS273DWRG4 by Texas Instruments

SN74ALS273DWRG4 by Texas Instruments is an 8-bit latch with a propagation delay of 15ns, ideal for applications requiring fast data storage and retrieval. Operating at a nominal voltage of 5V, it offers a max power supply current of 29mA and can handle load capacitance up to 50pF. With positive edge triggering and TTL technology, this flip-flop is suitable for commercial-grade temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,774 parts In-Stock

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Digiode

USA . 2,163 parts In-Stock

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2,163

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 330 parts In-Stock

1+ parts

$7.589

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330

$7.589

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Parana Technologies

USA . 666 parts In-Stock

1+ parts

$21.259

100+ parts

$1,974.261

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$19.133

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666

$21.259

$1,974.261

$19.133

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DigiPath Technology Company

USA . 2,355 parts In-Stock

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$23.409

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$21.537

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$23.409

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ChromeModa Solutions

Germany . 6,299 parts In-Stock

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$23.887

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$19.587

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$23.887

$19.587

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IDEA Electronic Components Group

UK . 1,088 parts In-Stock

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$23.887

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$22.693

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$21.498

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1,088

$23.887

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One Stop Electronics

USA . 1,110 parts In-Stock

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$54.000

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Ampacity Inc.

Singapore . 1,454 parts In-Stock

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$55.000

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Corphita

USA . 4,145 parts In-Stock

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Microchip USA

USA . 2,223 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the SN74ALS273DWRG4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments offers latches & flip-flops that are perfect for a wide range of applications. With a nominal supply voltage of 5V and a maximum operating temperature of 70°C, this product provides exceptional performance. Whether you're a hobbyist or a professional, this small outline package with dual terminal position is sure to meet your needs. Upgrade your designs today with Texas Instruments' SN74ALS273DWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 35000000 ns

Fast propagation delay ensures quick response time, making this latch ideal for time-sensitive applications.

Surface Mount: YES

Easy to install and saves space on the circuit board, making it suitable for compact designs.

No. of Bits: 8

Offers a sufficient number of bits for handling data, suitable for various digital applications.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with most systems and power sources.

Load Capacitance (CL): 50 pF

Low load capacitance minimizes power consumption and improves the overall efficiency of the latch.

Power Supplies (V): 5

Consistent power supply ensures reliable operation and performance of the latch.

No. of Terminals: 20

A sufficient number of terminals for versatile connectivity options, suitable for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

Compact and streamlined design makes it easy to integrate into different electronic systems.

Maximum I (ol): 24 Amp

High output current capability allows the latch to handle demanding loads without overheating.

Propagation Delay (tpd): 15 ns

Low propagation delay ensures fast data processing, enhancing the overall performance of the latch.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows the latch to function reliably in various environmental conditions.

Trigger Type: POSITIVE EDGE

Positive edge triggering enables precise control over the latch's operation, suitable for specific timing requirements.

Minimum Operating Temperature: 0 °C

Operational in low-temperature environments, making it reliable in diverse conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures reliable connections and long-term performance of the latch.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in installation and connection options, enhancing usability.

Maximum Seated Height: 2.65 mm

Low profile design makes it suitable for compact and space-constrained applications.

Width: 7.5 mm

Compact width allows for easy integration into various circuit layouts and designs.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and processing, improving overall system reliability.

Minimum Supply Voltage (Vsup): 4.5 V

Wide supply voltage range allows compatibility with different power sources and systems.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration, ensuring robust construction and quality.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the latch's reliability during assembly and soldering processes.

Length: 12.8 mm

Optimal length for easy installation and integration into various electronic systems.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications, ensuring compatibility with typical operating environments.

Technology: TTL

Utilizes TTL technology for reliable and efficient operation, compatible with a wide range of digital systems.

Terminal Form: GULL WING

Gull-wing terminals provide secure connections and ease of soldering during installation.

Packing Method: TR

Tray packaging method ensures safe transport and handling of the latch during distribution and installation.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy connection and compatibility with various circuit boards and layouts.

Minimum fmax: 35 MHz

High maximum frequency handling capability allows for fast data processing and operation of the latch.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance provides flexibility in power source options and system compatibility.

Maximum Power Supply Current (ICC): 29 mA

Low power supply current consumption ensures energy efficiency and cost-effectiveness in operation.

Technical Specifications

Latches & Flip-Flops SN74ALS273DWRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

29 mA

Propagation Delay At Nominal Supply:

35000000 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latch

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

35 MHz

Trade Compliance

SN74ALS273DWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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