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SN74ACT74MDREP

Texas Instruments

SN74ACT74MDREP by Texas Instruments

SN74ACT74MDREP by Texas Instruments is a dual-function latch with 14ns propagation delay, suitable for military-grade applications. It operates at a nominal voltage of 5V and has a max frequency of 85MHz. This CMOS technology flip-flop comes in a small outline package with surface mount capability.

Median Price

$2.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 586 parts In-Stock

1+ parts

$2.550

100+ parts

$2.050

1k+ parts

$1.490

10k+ parts

$1.390

586

$2.550

$2.050

$1.490

$1.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,624 parts In-Stock

1+ parts

$2.042

100+ parts

-

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-

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4,624

$2.042

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Vyrian

USA . 2,689 parts In-Stock

1+ parts

-

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2,689

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 821 parts In-Stock

1+ parts

$1.935

100+ parts

-

1k+ parts

-

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821

$1.935

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Parana Technologies

USA . 1,320 parts In-Stock

1+ parts

$18.945

100+ parts

-

1k+ parts

$19.010

10k+ parts

-

1,320

$18.945

-

$19.010

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DigiPath Technology Company

USA . 380 parts In-Stock

1+ parts

$20.860

100+ parts

$19.191

1k+ parts

-

10k+ parts

-

380

$20.860

$19.191

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ChromeModa Solutions

Germany . 2,290 parts In-Stock

1+ parts

$21.286

100+ parts

$17.455

1k+ parts

-

10k+ parts

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2,290

$21.286

$17.455

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IDEA Electronic Components Group

UK . 2,151 parts In-Stock

1+ parts

$21.286

100+ parts

$20.222

1k+ parts

$19.157

10k+ parts

-

2,151

$21.286

$20.222

$19.157

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QUARKTWIN TECHNOLOGY LTD

USA . 17,269 parts In-Stock

1+ parts

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17,269

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Microchip USA

USA . 9,165 parts In-Stock

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9,165

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Perfect Parts

USA . 3,553 parts In-Stock

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3,553

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Kepictronics

USA . 416 parts In-Stock

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416

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Overview

Texas Instruments presents the SN74ACT74MDREP, a high-quality latches & flip-flops component designed to meet your needs. With Texas Instruments' reputation for excellence in manufacturing, this product offers reliability and durability. Ideal for a variety of applications, this versatile component provides value and benefits to customers by delivering fast propagation delays and low power consumption. Trust Texas Instruments for all your electronic component needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the latch, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 14 ns

The low propagation delay ensures fast response times, making this latch suitable for high-speed applications.

Surface Mount: YES

The surface-mount capability allows for easy and efficient integration into PCB designs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common and easily accessible power source, making this latch compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in a variety of environments, including industrial and automotive applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this latch energy-efficient and reliable in noisy environments.

Technical Specifications

Latches & Flip-Flops SN74ACT74MDREP attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

85000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

85 MHz

Trade Compliance

SN74ACT74MDREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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