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SN65MLVD129DGGR

Texas Instruments

SN65MLVD129DGGR by Texas Instruments

SN65MLVD129DGGR by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3V. It offers differential output, complementary polarity, and a max transmit delay of 3ns. Ideal for industrial applications requiring EIA-899/TIA-899 interface standard compliance in compact designs.

Median Price

$4.534

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25,190 parts In-Stock

1+ parts

$4.534

100+ parts

$3.696

1k+ parts

$2.464

10k+ parts

-

25,190

$4.534

$3.696

$2.464

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 842 parts In-Stock

1+ parts

$4.307

100+ parts

-

1k+ parts

-

10k+ parts

-

842

$4.307

-

-

-

Vyrian

USA . 3,325 parts In-Stock

1+ parts

-

100+ parts

-

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3,325

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,167 parts In-Stock

1+ parts

$2.084

100+ parts

-

1k+ parts

$2.602

10k+ parts

-

2,167

$2.084

-

$2.602

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ChromeModa Solutions

Germany . 6,807 parts In-Stock

1+ parts

$2.342

100+ parts

$1.920

1k+ parts

-

10k+ parts

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6,807

$2.342

$1.920

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IDEA Electronic Components Group

UK . 2,151 parts In-Stock

1+ parts

$2.342

100+ parts

-

1k+ parts

$2.108

10k+ parts

-

2,151

$2.342

-

$2.108

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Corphita

USA . 1,115 parts In-Stock

1+ parts

$4.081

100+ parts

-

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1,115

$4.081

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AZTECH Wire

Italy . 783 parts In-Stock

1+ parts

$16.060

100+ parts

-

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783

$16.060

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A-Z Elektronik GmbH

Germany . 6,086 parts In-Stock

1+ parts

-

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6,086

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DigiPath Technology Company

USA . 2,337 parts In-Stock

1+ parts

-

100+ parts

$2.112

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2,337

-

$2.112

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Kepictronics

USA . 1,145 parts In-Stock

1+ parts

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1,145

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Overview

Upgrade your electronic designs with the SN65MLVD129DGGR by Texas Instruments, a top-of-the-line Line Driver & Receiver. With a reputation for excellence, Texas Instruments delivers unmatched quality and reliability in their products. This versatile component is ideal for a wide range of applications, offering customers unparalleled value and performance. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the SN65MLVD129DGGR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and resistant to impact, making it durable for various applications.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for compatibility with a wide range of systems and ensures reliable performance.

Maximum Transmit Delay: 3 ns

Low transmit delay ensures fast and efficient data transmission, making it suitable for real-time applications.

Output Characteristics: DIFFERENTIAL

Differential output allows for noise reduction and improved signal quality, making it ideal for high-speed data communication.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range (-40 to 85°C) ensures reliable operation in harsh environmental conditions.

Interface Standard: EIA-899; TIA-899

Compliance with industry standards ensures compatibility and interoperability with other equipment and systems.

Technical Specifications

Line Drivers & Receivers SN65MLVD129DGGR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

8

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

3 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

3 ns

Width:

6.1 mm

Trade Compliance

SN65MLVD129DGGR Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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