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SN65LV1224BDBRG4

Texas Instruments

SN65LV1224BDBRG4 by Texas Instruments

SN65LV1224BDBRG4 by Texas Instruments is a CMOS Line Receiver with 28 terminals, operating at -40 to 85 °C. It has a supply voltage range of 3-3.6 V and peak reflow temp of 260 C. Ideal for industrial applications requiring true output polarity and differential Schmitt trigger input characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 23,991 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Ampacity Inc.

Singapore . 219 parts In-Stock

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$4.500

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$4.500

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Corohmni

South Africa . 253 parts In-Stock

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$8.538

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Parana Technologies

USA . 1,149 parts In-Stock

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$11.532

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$11.945

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$11.945

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ChromeModa Solutions

Germany . 6,789 parts In-Stock

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$12.957

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$10.625

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$10.625

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IDEA Electronic Components Group

UK . 2,321 parts In-Stock

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$12.957

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$12.309

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$11.661

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AZTECH Wire

Italy . 854 parts In-Stock

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$14.523

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One Stop Electronics

USA . 578 parts In-Stock

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Semicontronic

India . 723 parts In-Stock

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Continental Prestige Electronics

USA . 5,846 parts In-Stock

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A-Z Elektronik GmbH

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Corphita

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Argo Parts USA

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Microchip USA

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DigiPath Technology Company

USA . 97 parts In-Stock

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Bastille Electronics

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Overview

Unlock unparalleled performance and reliability with the SN65LV1224BDBRG4 from Texas Instruments. As a leader in innovative technology, Texas Instruments delivers cutting-edge solutions for Line Drivers & Receivers, setting new standards for quality and precision in the industry. Ideal for a wide range of applications, this product offers customers unmatched value with its superior power efficiency, compact design, and advanced features. Elevate your projects with the SN65LV1224BDBRG4 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, the product can handle higher power requirements without risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving design for integration into tight spaces.

Power Supplies (V): 3.3

The 3.3 V power supply ensures stable and reliable performance of the product.

No. of Terminals: 28

The large number of terminals allows for versatile connection options and compatibility with various systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design make the product suitable for applications where space is limited.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environments and extended use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function reliably in cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for flexible installation and connectivity options in various setups.

Maximum Seated Height: 2 mm

The low seated height of 2 mm ensures the product can fit into compact spaces without sacrificing performance.

Width: 5.3 mm

The slim width of 5.3 mm enables the product to be used in applications with limited space available.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with other devices in the circuit.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure soldering during the manufacturing process.

Length: 10.2 mm

The compact length of 10.2 mm allows for easy integration into various electronic systems without taking up too much space.

Minimum Out Swing: 2 V

The minimum output swing of 2 V ensures reliable signal transmission and compatibility with different voltage levels.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating makes the product suitable for use in demanding environments and conditions.

Maximum Receive Delay: 0 ns

The zero receive delay ensures real-time signal reception and transmission for efficient communication.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high-speed performance for enhanced efficiency.

Terminal Form: GULL WING

The gull wing terminal form offers secure connections and easy soldering during installation for reliable operation.

Maximum Supply Current: 95 mA

With a maximum supply current of 95 mA, the product can handle higher power requirements without overheating or damage.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The use of differential Schmitt triggers for input ensures accurate signal detection and noise immunity for reliable performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures stable and consistent power delivery for optimal product performance.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting and efficient use of board space.

Interface IC Type: LINE RECEIVER

The line receiver interface IC type enables seamless communication and signal reception in various electronic systems.

Technical Specifications

Line Drivers & Receivers SN65LV1224BDBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

2 V

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

1

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

95 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN65LV1224BDBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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