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SN55501CJ

Texas Instruments

SN55501CJ by Texas Instruments

Texas Instruments SN55501CJ is a MOS technology graphics display driver with 40 terminals in an inline package. Operating temperature ranges from -55°C to 125°C, suitable for military-grade applications. It has a max supply current of 19mA and is ideal for high-temperature environments requiring reliable performance.

Median Price

$24.689

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 1 parts In-Stock

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$24.689

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Vyrian

USA . 4,116 parts In-Stock

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Digiode

USA . 1,592 parts In-Stock

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Electronic Expediters

USA . 82 parts In-Stock

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Electro Mavin

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Distributors (Availability)

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Parana Technologies

USA . 1,308 parts In-Stock

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$6.633

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$7.353

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ChromeModa Solutions

Germany . 6,829 parts In-Stock

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$7.453

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$6.111

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IDEA Electronic Components Group

UK . 618 parts In-Stock

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$7.453

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$6.708

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AZTECH Wire

Italy . 867 parts In-Stock

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$13.981

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One Stop Electronics

USA . 1,554 parts In-Stock

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$31.500

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Corphita

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DigiPath Technology Company

USA . 281 parts In-Stock

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$6.720

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Overview

Elevate your display driver experience with the SN55501CJ from Texas Instruments. Crafted with precision and excellence, this graphics display driver offers unrivaled quality and reliability. Ideal for military-grade applications, this product ensures seamless performance even in extreme temperatures. With 40 terminals and a ceramic package body, the SN55501CJ delivers superior functionality and durability. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations. Upgrade your projects today with the SN55501CJ and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity, which allows for efficient heat dissipation and helps in maintaining stable performance over an extended period of time.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and installation into various devices and systems.

No. of Terminals: 40

Having a higher number of terminals allows for more connectivity options and flexibility in designing and customizing the product for different applications.

Package Style (Meter): IN-LINE

In-line package style offers a compact and space-saving design, making it suitable for applications where size constraints are a concern.

Maximum Operating Temperature: 125 °C

High maximum operating temperature makes the product suitable for use in harsh environmental conditions without compromising on performance.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal integrity, enhancing the overall reliability of the product.

Temperature Grade: MILITARY

Military-grade temperature rating ensures robustness and durability, making the product ideal for demanding military and aerospace applications.

Technology: MOS

MOS technology offers high speed and energy efficiency, resulting in better performance and lower power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong mechanical connections, reducing the risk of terminal breakage and ensuring long-term reliability.

Maximum Supply Current: 19 mA

Low maximum supply current helps in conserving power and minimizing energy consumption, making the product cost-effective and environmentally friendly.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy assembly and compatibility with commonly used connectors and sockets, simplifying the integration process.

Technical Specifications

Graphics Display Drivers SN55501CJ attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Maximum Supply Current:

19 mA

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN55501CJ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-233-0647, 5962012330647

NIIN

012330647

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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