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SN55500AJD

Texas Instruments

SN55500AJD by Texas Instruments

Texas Instruments SN55500AJD is a 40-terminal graphics display driver in ceramic package. With operating temperatures ranging from -55°C to 125°C, it's ideal for military-grade applications. Featuring an in-line rectangular shape, this driver has dual terminal positions and 2.54mm pitch for through-hole mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,117

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-

-

-

Digiode

USA . 2,445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,445

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,047 parts In-Stock

1+ parts

$4.851

100+ parts

-

1k+ parts

$5.375

10k+ parts

-

1,047

$4.851

-

$5.375

-

DigiPath Technology Company

USA . 1,400 parts In-Stock

1+ parts

$5.342

100+ parts

-

1k+ parts

-

10k+ parts

-

1,400

$5.342

-

-

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ChromeModa Solutions

Germany . 6,462 parts In-Stock

1+ parts

$5.451

100+ parts

$4.470

1k+ parts

-

10k+ parts

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6,462

$5.451

$4.470

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IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$5.451

100+ parts

-

1k+ parts

$4.906

10k+ parts

-

961

$5.451

-

$4.906

-

AZTECH Wire

Italy . 318 parts In-Stock

1+ parts

$9.856

100+ parts

-

1k+ parts

-

10k+ parts

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318

$9.856

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-

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One Stop Electronics

USA . 879 parts In-Stock

1+ parts

$27.500

100+ parts

-

1k+ parts

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10k+ parts

-

879

$27.500

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-

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Corphita

USA . 337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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337

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Overview

Enhance your graphics display with the SN55500AJD by Texas Instruments, a top-quality solution for all your display driver needs. Manufactured by a trusted industry leader, this product offers unparalleled reliability and performance in a variety of applications. With its durable ceramic construction and military-grade temperature rating, you can trust this driver to deliver exceptional results in even the most demanding environments. Upgrade your display capabilities today and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity and excellent stability, making it a reliable choice for electronic components that require good heat dissipation and durability.

No. of Terminals: 40

Having a higher number of terminals allows for greater connectivity options and compatibility with various systems and devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this graphics display driver can perform reliably in demanding environments without overheating.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, reducing the risk of connectivity issues and ensuring the stability of the graphics display driver.

Technical Specifications

Graphics Display Drivers SN55500AJD attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN55500AJD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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