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SN54HC04VTDE2

Texas Instruments

SN54HC04VTDE2 by Texas Instruments

SN54HC04VTDE2 by Texas Instruments is a CMOS logic gate with 6 functions in a rectangular package. It has 14 terminals, measures 0.889mm wide and 1.016mm long, and comes in a tube packaging. Ideal for surface mount applications, this chip is commonly used in digital circuits for signal processing and control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,971 parts In-Stock

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Digiode

USA . 4,640 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 220 parts In-Stock

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$14.064

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$14.064

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Parana Technologies

USA . 1,405 parts In-Stock

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$17.448

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$17.647

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$17.647

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DigiPath Technology Company

USA . 1,339 parts In-Stock

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$19.212

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1,339

$19.212

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ChromeModa Solutions

Germany . 3,697 parts In-Stock

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$19.604

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$16.075

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3,697

$19.604

$16.075

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IDEA Electronic Components Group

UK . 729 parts In-Stock

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$19.604

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$18.624

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$17.644

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729

$19.604

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$17.644

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One Stop Electronics

USA . 364 parts In-Stock

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$43.000

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Corphita

USA . 1,666 parts In-Stock

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Overview

Unlock the power of advanced technology with the Texas Instruments SN54HC04VTDE2 Logic Gates. Manufactured by a trusted industry leader, this high-quality product offers unparalleled performance and reliability. Ideal for a wide range of applications, this logic gate provides seamless integration and efficient operation. Experience the value and benefits of Texas Instruments technology with the SN54HC04VTDE2, delivering superior results for all your electronic projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving time and effort.

No. of Functions: 6

Having multiple functions in one component can help simplify circuit design and reduce the number of components needed.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

No. of Terminals: 14

More terminals provide flexibility in connecting to other components and circuitry.

Package Style (Meter): UNCASED CHIP

Uncased chip style offers compactness and lightweight design.

Terminal Position: UPPER

Upper terminal position can enhance accessibility for connections during assembly.

Width: 0.889 mm

Narrow width allows for close arrangement of components on the circuit board.

Length: 1.016 mm

Compact length saves space and ensures a neat layout on the circuit board.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and comply with RoHS regulations.

Packing Method: TUBE

Tube packaging provides protection during storage and transportation, preventing damage to the component.

Technical Specifications

Logic Gates SN54HC04VTDE2 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-XUUC-N14

Length:

1.016 mm

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.889 mm

Trade Compliance

SN54HC04VTDE2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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