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SN54HC00TDF2

Texas Instruments

SN54HC00TDF2 by Texas Instruments

SN54HC00TDF2 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It operates at supply voltages b/w 2V to 6V, with a max output current of 4A. This surface-mount chip is ideal for applications requiring compact, high-performance logic gates in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,885 parts In-Stock

1+ parts

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8,885

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Digiode

USA . 3,033 parts In-Stock

1+ parts

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3,033

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 239 parts In-Stock

1+ parts

$8.113

100+ parts

-

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239

$8.113

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Parana Technologies

USA . 2,243 parts In-Stock

1+ parts

$11.327

100+ parts

$1,051.887

1k+ parts

$10.194

10k+ parts

-

2,243

$11.327

$1,051.887

$10.194

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DigiPath Technology Company

USA . 993 parts In-Stock

1+ parts

$12.472

100+ parts

-

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993

$12.472

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ChromeModa Solutions

Germany . 6,202 parts In-Stock

1+ parts

$12.727

100+ parts

$10.436

1k+ parts

-

10k+ parts

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6,202

$12.727

$10.436

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IDEA Electronic Components Group

UK . 2,263 parts In-Stock

1+ parts

$12.727

100+ parts

$12.091

1k+ parts

$11.454

10k+ parts

-

2,263

$12.727

$12.091

$11.454

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One Stop Electronics

USA . 398 parts In-Stock

1+ parts

$45.000

100+ parts

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398

$45.000

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Microchip USA

USA . 1,965 parts In-Stock

1+ parts

$84.290

100+ parts

$82.820

1k+ parts

$82.090

10k+ parts

$81.360

1,965

$84.290

$82.820

$82.090

$81.360

Corphita

USA . 997 parts In-Stock

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997

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Overview

Upgrade your electronics projects with the SN54HC00TDF2 logic gates by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers reliability and precision in every component. Ideal for a wide range of applications, these logic gates offer unmatched performance and efficiency. Whether you're working on circuit design or automation systems, this product provides exceptional value and benefits, making it a must-have for any project. Trust Texas Instruments to elevate your creations to the next level.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to mount on PCBs, saving space and simplifying the assembly process.

No. of Functions: 4

Offers multiple logic functions in a single package, reducing the need for multiple individual components.

No. of Inputs: 2

Suitable for basic logic operations that require two input signals.

Package Shape: RECTANGULAR

Standard shape that fits well on circuit boards and allows for efficient placement.

No. of Terminals: 14

Provides multiple connection points for versatility in use and compatibility with various circuits.

Package Style (Meter): UNCASED CHIP

Offers a compact and simplified design for integration into electronic circuits.

Maximum I (ol): 4 Amp

Can handle relatively high output currents, suitable for a wide range of applications.

Terminal Position: UPPER

Facilitates easy connection to other components or the circuit board.

Width: 1.0903 mm

Compact size enables high-density arrangements on PCBs for efficient use of space.

Minimum Supply Voltage (Vsup): 2 V

Operates at low voltage levels, suitable for battery-powered devices or low-power applications.

Length: 1.2553 mm

Compact form factor that can fit into small spaces or densely populated circuit boards.

Technology: CMOS

Provides low power consumption and high noise immunity, ideal for modern electronic devices.

Terminal Form: NO LEAD

Simplifies the mounting process and reduces the risk of soldering issues.

Packing Method: TUBE

Secure packaging method for transportation and storage, preventing damage to the components.

Maximum Supply Voltage (Vsup): 6 V

Supports a wide range of operating voltages, making it versatile for different circuit designs.

Technical Specifications

Logic Gates SN54HC00TDF2 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-XUUC-N14

Length:

1.2553 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.0903 mm

Trade Compliance

SN54HC00TDF2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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