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RM42L432BPZT

Texas Instruments

RM42L432BPZT by Texas Instruments

Texas Instruments RM42L432BPZT microcontroller features 32-bit CPU, 100 MHz clock frequency, and 16-Ch 12-Bit ADC. Ideal for industrial applications requiring low power mode, with peripherals like POR, QEP, and CAN connectivity.

Median Price

$11.592

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 24 parts In-Stock

1+ parts

$8.288

100+ parts

$6.600

1k+ parts

-

10k+ parts

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24

$8.288

$6.600

-

-

Texas Instruments

USA . 2,970 parts In-Stock

1+ parts

$8.473

100+ parts

$7.401

1k+ parts

$5.104

10k+ parts

-

2,970

$8.473

$7.401

$5.104

-

DigiKey

USA . 430 parts In-Stock

1+ parts

$14.710

100+ parts

$10.034

1k+ parts

$9.131

10k+ parts

-

430

$14.710

$10.034

$9.131

-

Mouser Electronics

USA . 160 parts In-Stock

1+ parts

$14.710

100+ parts

$10.030

1k+ parts

$9.130

10k+ parts

-

160

$14.710

$10.030

$9.130

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 783 parts In-Stock

1+ parts

$7.874

100+ parts

-

1k+ parts

-

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783

$7.874

-

-

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Vyrian

USA . 3,582 parts In-Stock

1+ parts

-

100+ parts

-

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3,582

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Chip Stock

USA . 3,180 parts In-Stock

1+ parts

-

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3,180

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Cyclops Electronics Ltd

UK . 31 parts In-Stock

1+ parts

-

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31

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Halfin

Belgium . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,618 parts In-Stock

1+ parts

$7.459

100+ parts

-

1k+ parts

-

10k+ parts

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4,618

$7.459

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-

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Parana Technologies

USA . 1,953 parts In-Stock

1+ parts

$37.319

100+ parts

-

1k+ parts

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10k+ parts

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1,953

$37.319

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DigiPath Technology Company

USA . 323 parts In-Stock

1+ parts

$41.093

100+ parts

$37.806

1k+ parts

-

10k+ parts

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323

$41.093

$37.806

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-

IDEA Electronic Components Group

UK . 2,304 parts In-Stock

1+ parts

$41.932

100+ parts

$39.835

1k+ parts

$37.739

10k+ parts

-

2,304

$41.932

$39.835

$37.739

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ChromeModa Solutions

Germany . 360 parts In-Stock

1+ parts

$41.932

100+ parts

$34.384

1k+ parts

-

10k+ parts

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360

$41.932

$34.384

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-

Lixinc

USA . 14,911 parts In-Stock

1+ parts

-

100+ parts

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14,911

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A-Z Elektronik GmbH

Germany . 5,879 parts In-Stock

1+ parts

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5,879

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Futuretech Components

Singapore . 236 parts In-Stock

1+ parts

-

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236

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Overview

Discover the innovative RM42L432BPZT microcontroller by Texas Instruments, setting the benchmark for quality and reliability in the industry. With a wide range of applications and cutting-edge technology, this product offers customers unmatched value and benefits. From its low power mode to its extensive peripherals, the RM42L432BPZT is designed to enhance performance and efficiency. Trust Texas Instruments to deliver top-notch solutions for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for compact electronic devices.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.32 V

Efficient power consumption and compatibility with low voltage systems.

On Chip Data RAM Width: 8

Efficient data processing capabilities with a wider RAM width.

Bit Size: 32

High processing capability and support for complex algorithms.

No. of Terminals: 100

Sufficient connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Space-saving design suitable for compact electronic devices.

Minimum Supply Voltage: 1.14 V

Support for low voltage operation for energy efficiency.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications that require high temperature tolerance.

CPU Family: CORTEX-R4F

High-performance Cortex-R4F CPU family for efficient data processing.

No. of External Interrupts: 8

Support for multiple external interrupts for real-time event handling.

Minimum Operating Temperature: -40 °C

Wide temperature range support for operation in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality finish for reliable electrical connections and corrosion resistance.

ADC Channels: YES

Analog to digital conversion capabilities for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad position terminals for efficient PCB layout and connectivity.

ROM Words: 393216

Large ROM capacity for storing program instructions and data.

Technical Specifications

Microcontrollers RM42L432BPZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

100 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

8

No. of I/O Lines:

45

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

19

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

CAN(2), LIN, MIBSPI, SCI, SPI(2)

Peripherals:

POR, QEP, TIMER(19), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

RM42L432BPZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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