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RM42L432PZT

Texas Instruments

RM42L432PZT by Texas Instruments

The Texas Instruments RM42L432PZT is a 32-bit microcontroller with 32768 bytes of RAM and 393216 ROM words. Operating at up to 100 MHz, it features 45 I/O lines, PWM channels, and ADC channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,519 parts In-Stock

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Digiode

USA . 3,443 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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90

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Bristol Electronics

USA . 90 parts In-Stock

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90

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Dan-Mar Components

USA . 90 parts In-Stock

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90

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Distributors (Availability)

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AZTECH Wire

Italy . 837 parts In-Stock

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$12.356

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$12.356

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One Stop Electronics

USA . 581 parts In-Stock

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$13.000

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Parana Technologies

USA . 2,325 parts In-Stock

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$33.811

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$135.167

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$33.811

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$135.167

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DigiPath Technology Company

USA . 1,815 parts In-Stock

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$37.230

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$34.252

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ChromeModa Solutions

Germany . 539 parts In-Stock

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$37.990

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$31.152

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IDEA Electronic Components Group

UK . 27 parts In-Stock

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$37.990

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$36.090

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$34.191

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27

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,628 parts In-Stock

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Lixinc

USA . 3,824 parts In-Stock

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Corphita

USA . 1,403 parts In-Stock

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Microchip USA

USA . 362 parts In-Stock

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Perfect Parts

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Kepictronics

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Overview

Unleash the power of innovation with the RM42L432PZT microcontroller by Texas Instruments. From its cutting-edge technology to its reliable performance, this product exemplifies the quality and expertise that TI is known for. Ideal for a wide range of applications, this microcontroller offers unmatched value and benefits to customers looking for top-notch performance and versatility. Take your projects to the next level with the RM42L432PZT and experience the advantages of using a world-class product from a trusted manufacturer like Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and strength to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and making assembly easier.

Maximum Supply Voltage: 1.32 V

Operating within this voltage range ensures stability and reliability of the microcontroller.

Bit Size: 32

A 32-bit microcontroller offers higher performance and processing capabilities compared to lower-bit alternatives.

Power Supplies (V): 1.2

Having a low power supply voltage helps in energy efficiency and reducing heat generation.

No. of Terminals: 100

Having a high number of terminals allows for greater connectivity options and integration with other components.

Maximum Operating Temperature: 105 °C

With a high operating temperature range, the microcontroller can function reliably in various environmental conditions.

CPU Family: CORTEX-R4

Being part of the Cortex-R4 family indicates high performance and real-time processing capabilities.

ADC Channels: YES

Having Analog-to-Digital Converter channels allows for interfacing with analog sensors and signals.

ROM Words: 393216

A large ROM size provides ample storage capacity for programs and data in the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller ensures efficient and fast execution of instructions.

RAM Bytes: 32768

A sufficient amount of RAM enables smooth and multitasking operation of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds.

Maximum Supply Current: 150 mA

With a moderate current requirement, the microcontroller can operate efficiently without excessive power consumption.

Technical Specifications

Microcontrollers RM42L432PZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4

Maximum Clock Frequency:

100 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

45

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

RM42L432PZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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