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RI-STU-MRD1

Texas Instruments

RI-STU-MRD1 by Texas Instruments

RI-STU-MRD1 by Texas Instruments is a telecom IC with 30 terminals in RECTANGULAR package. Operates b/w -20°C to 50°C, with nominal voltage of 5V. Ideal for TELECOM CIRCUIT applications due to its MICROELECTRONIC ASSEMBLY style and DUAL terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,772 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,772

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Digiode

USA . 4,727 parts In-Stock

1+ parts

-

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1k+ parts

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4,727

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 753 parts In-Stock

1+ parts

$6.035

100+ parts

$560.450

1k+ parts

$5.432

10k+ parts

-

753

$6.035

$560.450

$5.432

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DigiPath Technology Company

USA . 51 parts In-Stock

1+ parts

$6.645

100+ parts

$6.114

1k+ parts

-

10k+ parts

-

51

$6.645

$6.114

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ChromeModa Solutions

Germany . 3,624 parts In-Stock

1+ parts

$6.781

100+ parts

$5.560

1k+ parts

-

10k+ parts

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3,624

$6.781

$5.560

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IDEA Electronic Components Group

UK . 1,186 parts In-Stock

1+ parts

$6.781

100+ parts

-

1k+ parts

$6.103

10k+ parts

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1,186

$6.781

-

$6.103

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AZTECH Wire

Italy . 212 parts In-Stock

1+ parts

$8.989

100+ parts

-

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10k+ parts

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212

$8.989

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One Stop Electronics

USA . 495 parts In-Stock

1+ parts

$750.000

100+ parts

-

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495

$750.000

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Corphita

USA . 363 parts In-Stock

1+ parts

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363

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Overview

Elevate your telecommunications projects with the RI-STU-MRD1 by Texas Instruments. Designed with precision and reliability in mind, this telecom interface IC offers unparalleled performance and functionality. Whether you're working on phone systems, network equipment, or other communication devices, this product is a must-have for seamless integration and top-notch results. Trust in Texas Instruments' reputation for excellence and innovation, and experience the value and benefits that the RI-STU-MRD1 brings to your projects.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape provides easy handling and space optimization for efficient integration into telecommunication systems.

No. of Terminals: 30

With 30 terminals, this telecom interface IC offers a wide range of connection options for versatile applications and flexibility in circuit design.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style ensures precise and reliable performance in telecom applications, making it a dependable choice for critical operations.

Maximum Operating Temperature: 50 °C

The high maximum operating temperature of 50°C allows the IC to withstand demanding environmental conditions, ensuring stable performance in various settings.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20°C enables the IC to function effectively even in cold environments, increasing its usability in diverse scenarios.

Terminal Position: DUAL

The dual terminal position offers redundancy and improved signal integrity, enhancing the reliability of the IC in telecommunication systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and ensures secure connections, making the IC easy to install and maintain.

Telecom IC Type: TELECOM CIRCUIT

As a specialized telecom circuit IC, it is specifically designed to meet the requirements of telecommunication applications, providing optimized performance and functionality.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in telecom systems, ensuring compatibility and easy integration of the IC with existing setups.

Technical Specifications

Other Function Telecom Interface ICs RI-STU-MRD1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDMA-T30

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

RI-STU-MRD1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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