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RI-R6C-001A-02

Texas Instruments

RI-R6C-001A-02 by Texas Instruments

RI-R6C-001A-02 by Texas Instruments is a telecom interface IC with 20 terminals in a small outline package. Operating b/w -40°C to 85°C, it has a terminal pitch of 0.65mm and gull wing form. Ideal for industrial applications requiring compact design and surface mount capability.

Median Price

$19.564

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Voyager Components

USA . 1 parts In-Stock

1+ parts

$19.564

100+ parts

$19.564

1k+ parts

$19.564

10k+ parts

$19.564

1

$19.564

$19.564

$19.564

$19.564

Vyrian

USA . 8,480 parts In-Stock

1+ parts

-

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-

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8,480

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-

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Digiode

USA . 642 parts In-Stock

1+ parts

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-

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642

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 816 parts In-Stock

1+ parts

$9.743

100+ parts

-

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816

$9.743

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Parana Technologies

USA . 23 parts In-Stock

1+ parts

$10.142

100+ parts

-

1k+ parts

$10.682

10k+ parts

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23

$10.142

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$10.682

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ChromeModa Solutions

Germany . 3,746 parts In-Stock

1+ parts

$11.395

100+ parts

$9.344

1k+ parts

-

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3,746

$11.395

$9.344

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IDEA Electronic Components Group

UK . 1,317 parts In-Stock

1+ parts

$11.395

100+ parts

$10.825

1k+ parts

$10.256

10k+ parts

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1,317

$11.395

$10.825

$10.256

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One Stop Electronics

USA . 890 parts In-Stock

1+ parts

$530.000

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890

$530.000

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Corphita

USA . 3,234 parts In-Stock

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3,234

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DigiPath Technology Company

USA . 149 parts In-Stock

1+ parts

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$10.274

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149

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$10.274

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Overview

Enhance your telecom systems with the RI-R6C-001A-02 by Texas Instruments, a top-quality telecom interface IC that guarantees seamless performance and reliability. Manufactured by industry leader Texas Instruments, this product offers unmatched value and benefits for a wide range of applications in the telecom industry. With its advanced features and durable construction, this telecom IC is designed to meet the highest standards of quality and efficiency. Upgrade your telecom systems today with the RI-R6C-001A-02 and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for telecom applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, making it suitable for space-constrained telecom equipment.

No. of Terminals: 20

Having 20 terminals allows for connection to multiple external devices or circuits, increasing the versatility of this telecom interface IC.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range of -40 to 85°C ensures reliable performance in harsh operating environments commonly found in telecom systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections to the circuit board, minimizing the risk of disconnection or signal interference.

Technical Specifications

Other Function Telecom Interface ICs RI-R6C-001A-02 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

2 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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