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PLM393LVDR

Texas Instruments

PLM393LVDR by Texas Instruments

The Texas Instruments PLM393LVDR is a comparator with 2 functions, featuring a max input offset voltage of 2500 uV and max average bias current of 0.00005 uA. With a small outline package style, it is ideal for automotive applications due to its wide operating temperature range from -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,114 parts In-Stock

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Digiode

USA . 2,536 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Parana Technologies

USA . 2,321 parts In-Stock

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$3.186

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$3.708

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$3.186

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Ampacity Inc.

Singapore . 1,099 parts In-Stock

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$3.410

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$3.410

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DigiPath Technology Company

USA . 2,364 parts In-Stock

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$3.508

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$3.508

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ChromeModa Solutions

Germany . 4,826 parts In-Stock

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$3.580

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$2.936

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4,826

$3.580

$2.936

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IDEA Electronic Components Group

UK . 1,996 parts In-Stock

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$3.580

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$3.222

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One Stop Electronics

USA . 1,065 parts In-Stock

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$9.410

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$9.410

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AZTECH Wire

Italy . 697 parts In-Stock

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$19.266

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Corphita

USA . 3,849 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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Overview

Upgrade your systems with the high-quality PLM393LVDR comparator from Texas Instruments. Designed with precision and reliability in mind, this small outline package features dual terminals and a wide operating temperature range, making it ideal for automotive applications where performance is key. With a fast response time of 600 ns and low power consumption, this comparator offers exceptional value and efficiency to customers looking to enhance their electronic designs. Trust Texas Instruments for cutting-edge technology that delivers superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material is durable and reliable, making the product suitable for a variety of applications.

Maximum Input Offset Voltage: 2500 uV

Low input offset voltage ensures accurate and precise comparator operations in various circuits.

Maximum Average Bias Current (IIB): 0.00005 uA

Low bias current helps in minimizing power consumption and improving efficiency of the comparator.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly and space-saving design.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage makes integration into existing systems simple and hassle-free.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance even in harsh environments.

Output Type: OPEN-DRAIN

Open-drain output configuration allows for easy interfacing with other digital devices and circuits.

Nominal Response Time: 600 ns

Fast response time ensures quick and efficient comparator operation in time-critical applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range ensures the product is suitable for automotive applications where temperature fluctuations are common.

Packing Method: TR

TR packing method provides components in a tape reel format, making it convenient for automated assembly processes.

Technical Specifications

Comparators PLM393LVDR attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

2.5 mV

Peak Bias Current:

50 pA

Operational Characteristics

Maximum Supply Current:

70 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

600 ns

Physical Characteristics

Length:

0.193 in (4.905 mm)

Width:

0.153 in (3.895 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

PLM393LVDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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