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PLM339BIDR

Texas Instruments

PLM339BIDR by Texas Instruments

The Texas Instruments PLM339BIDR is a comparator with 4 functions, featuring a max input offset voltage of 3500 uV and max supply voltage limit of 38 V. Ideal for applications requiring fast response times (1000 ns) in a small outline package style, suitable for surface mount technology.

Median Price

$0.080

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 57 parts In-Stock

1+ parts

$0.080

100+ parts

-

1k+ parts

-

10k+ parts

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57

$0.080

-

-

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Vyrian

USA . 5,003 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,003

-

-

-

-

Digiode

USA . 593 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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593

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.080

100+ parts

$0.078

1k+ parts

$0.076

10k+ parts

$0.074

1,000

$0.080

$0.078

$0.076

$0.074

Ampacity Inc.

Singapore . 980 parts In-Stock

1+ parts

$7.410

100+ parts

-

1k+ parts

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10k+ parts

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980

$7.410

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One Stop Electronics

USA . 663 parts In-Stock

1+ parts

$8.410

100+ parts

-

1k+ parts

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10k+ parts

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663

$8.410

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AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$11.703

100+ parts

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1k+ parts

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10k+ parts

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338

$11.703

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Corphita

USA . 3,466 parts In-Stock

1+ parts

-

100+ parts

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3,466

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Overview

Upgrade your electronics with the Texas Instruments PLM339BIDR Comparator. Experience top-notch quality and reliability from a trusted manufacturer. Perfect for a wide range of applications, this comparator offers unmatched value and performance. Enhance your projects with precision and efficiency using this advanced technology. Choose Texas Instruments for superior products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components and ensures durability of the product.

Maximum Input Offset Voltage: 3500 uV

Low input offset voltage ensures accurate comparison and reliable performance.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common supply voltages, making it versatile for various applications.

Output Type: OPEN-COLLECTOR

Open-collector output allows for flexibility in connecting external devices and circuits.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes it suitable for use in different environmental conditions.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise comparisons.

Amplifier Type: COMPARATOR

Specifically designed for comparison tasks, ensuring accurate and reliable results.

Technical Specifications

Comparators PLM339BIDR attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

4

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

3.5 mV

Peak Bias Current:

50 nA

Maximum Bias Current (IIB) @25 °C:

25 nA

Operational Characteristics

Maximum Supply Current:

1.6 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

38 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Nominal Response Time:

1 µs

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP14,.24

Trade Compliance

PLM339BIDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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