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PDRV83053QPHPRQ1

Texas Instruments

PDRV83053QPHPRQ1 by Texas Instruments

PDRV83053QPHPRQ1 by Texas Instruments is a Motion Control IC with 48 terminals, operating voltage range of 4.4V to 45V, and AEC-Q100 screening for automotive applications. It features a compact square package style with gull wing terminals suitable for brushless DC motor control in automotive systems, offering high reliability from -40°C to 125°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,764 parts In-Stock

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Digiode

USA . 1,720 parts In-Stock

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1,720

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Distributors (Availability)

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Ampacity Inc.

Singapore . 936 parts In-Stock

1+ parts

$0.500

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936

$0.500

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One Stop Electronics

USA . 1,106 parts In-Stock

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$3.500

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$3.500

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Semicontronic

India . 606 parts In-Stock

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$4.500

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$4.388

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$4.365

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606

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 352 parts In-Stock

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$8.151

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352

$8.151

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Parana Technologies

USA . 1,504 parts In-Stock

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$21.936

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$22.446

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1,504

$21.936

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$22.446

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ChromeModa Solutions

Germany . 3,280 parts In-Stock

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$24.647

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$20.211

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3,280

$24.647

$20.211

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IDEA Electronic Components Group

UK . 201 parts In-Stock

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$24.647

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$23.415

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$22.182

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201

$24.647

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$22.182

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Corphita

USA . 2,101 parts In-Stock

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DigiPath Technology Company

USA . 1,409 parts In-Stock

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$22.222

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1,409

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$22.222

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Microchip USA

USA . 148 parts In-Stock

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Corohmni

South Africa . 61 parts In-Stock

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Overview

Enhance your motion control applications with the PDRV83053QPHPRQ1 by Texas Instruments. Crafted with precision and reliability in mind, this Brushless DC Motor Controller offers unparalleled performance and efficiency. Ideal for automotive use, this innovative IC boasts a wide operating temperature range and high supply voltage capacity, ensuring optimal functionality in any environment. Elevate your projects with Texas Instruments' cutting-edge technology and experience seamless motion control like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to environmental factors, making the product suitable for automotive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and simplifying assembly process.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making the product suitable for automotive use where durability is crucial.

Nominal Supply Voltage (Vsup): 12 V

The 12V supply voltage is commonly used in automotive systems, ensuring compatibility and ease of integration.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and integration with a variety of systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand harsh operating conditions in automotive environments.

Minimum Operating Temperature: -40 °C

The product can operate efficiently even in extreme cold environments, making it suitable for a wide range of applications.

Maximum Seated Height: 1.2 mm

Low seated height helps in reducing the overall profile of the product, allowing for compact and space-saving designs.

Width (mm): 7 mm

The compact width of 7mm ensures compatibility with various PCB layouts and space constraints.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and efficient use of PCB space.

Technical Specifications

Motion Control ICs PDRV83053QPHPRQ1 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

45 V

Minimum Supply Voltage (Vsup):

4.4 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

PDRV83053QPHPRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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