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PDRV5053PAQLPG

Texas Instruments

PDRV5053PAQLPG by Texas Instruments

PDRV5053PAQLPG by Texas Instruments is a magnetic field sensor with 2.5-38V supply voltage range, -40 to 125°C operating temperature, and 0-2V analog output. Ideal for applications requiring precise Hall effect sensing in compact spaces due to its small body dimensions of 1.52" x 4mm x 5.05mm and through-hole mounting feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,275 parts In-Stock

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Digiode

USA . 4,072 parts In-Stock

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Parana Technologies

USA . 2,341 parts In-Stock

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$2.107

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$2.622

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DigiPath Technology Company

USA . 1,887 parts In-Stock

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$2.320

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$2.320

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ChromeModa Solutions

Germany . 4,660 parts In-Stock

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$2.367

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$1.941

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IDEA Electronic Components Group

UK . 1,972 parts In-Stock

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$2.367

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$2.130

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One Stop Electronics

USA . 1,498 parts In-Stock

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$9.750

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$9.750

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Semicontronic

India . 1,237 parts In-Stock

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$10.750

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$10.481

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$10.428

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AZTECH Wire

Italy . 610 parts In-Stock

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$14.958

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Ampacity Inc.

Singapore . 658 parts In-Stock

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$35.750

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Corphita

USA . 4,849 parts In-Stock

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Corohmni

South Africa . 360 parts In-Stock

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Overview

Elevate your sensing capabilities with the PDRV5053PAQLPG by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch magnetic field sensors that offer unparalleled precision and reliability. Whether you're looking to enhance automotive systems, industrial automation, or consumer electronics, this sensor provides unmatched value and performance. Experience peace of mind knowing you're getting a high-quality product that will exceed your expectations. Unlock new possibilities with the PDRV5053PAQLPG and take your projects to the next level.

Feature Benefit Bullets

Maximum Supply Voltage: 38 V

High maximum supply voltage allows for flexibility in different power supply applications.

Body Width: 1.52 inch

Compact size makes it suitable for applications where space is limited.

Sensors or Transducers Type: MAGNETIC FIELD SENSOR,HALL EFFECT

Hall effect sensors provide accurate and reliable measurements of magnetic fields.

Body Height: 5.05 mm

Low profile design enables easy integration into various devices.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easy mounting and placement in applications.

Minimum Supply Voltage: 2.5 V

Low minimum supply voltage helps in conserving power and reducing energy consumption.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliability in various environmental conditions.

Output Range: 0-2V

The analog voltage output range provides precise data for magnetic field measurements.

Output Type: ANALOG VOLTAGE

Analog voltage output allows for easy interfacing with microcontrollers or data acquisition systems.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature makes it suitable for use in cold environments.

Maximum Operating Current: 3.6 mA

Low operating current helps in reducing power consumption and heat generation.

Body Length/Diameter: 4 mm

Compact body length enables easy integration and placement in various applications.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for the sensor.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature simplifies the installation process and ensures stability.

Technical Specifications

Magnetic Field Sensors PDRV5053PAQLPG attributes and parameters. Explore more Magnetic Field Sensors devices from Texas Instruments

Specs

Additional Features:

SHORT CIRCUIT PROTECTION

Body Width:

1.52 inch

Body Height:

5.05 mm

Body Length/Diameter:

4 mm

Linearity (%):

1

Mounting Feature:

Maximum Operating Current:

3.6 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Range:

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

38 V

Minimum Supply Voltage:

2.5 V

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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