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PCM3002EG/2K

Texas Instruments

PCM3002EG/2K by Texas Instruments

PCM3002EG/2K by Texas Instruments is a 24-terminal consumer IC with 3V power supply, operating b/w -25 to 85°C. It features CMOS technology, Gull Wing terminals, and small outline package style. Ideal for consumer circuits requiring compact design and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,208 parts In-Stock

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4,208

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Digiode

USA . 2,701 parts In-Stock

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2,701

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

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2,000

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Distributors (Availability)

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Parana Technologies

USA . 1,776 parts In-Stock

1+ parts

$1.472

100+ parts

-

1k+ parts

$2.152

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1,776

$1.472

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$2.152

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DigiPath Technology Company

USA . 551 parts In-Stock

1+ parts

$1.621

100+ parts

$1.491

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551

$1.621

$1.491

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ChromeModa Solutions

Germany . 3,504 parts In-Stock

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$1.654

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$1.356

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3,504

$1.654

$1.356

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IDEA Electronic Components Group

UK . 207 parts In-Stock

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$1.654

100+ parts

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$1.489

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207

$1.654

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$1.489

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AZTECH Wire

Italy . 692 parts In-Stock

1+ parts

$11.510

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692

$11.510

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One Stop Electronics

USA . 789 parts In-Stock

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$19.800

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789

$19.800

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Lixinc

USA . 12,813 parts In-Stock

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Corphita

USA . 4,864 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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4,480

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Kepictronics

USA . 711 parts In-Stock

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711

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Microchip USA

USA . 258 parts In-Stock

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258

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Overview

Discover the cutting-edge PCM3002EG/2K by Texas Instruments, a top-tier manufacturer known for superior quality in the realm of Other Function Consumer ICs. This high-performance product offers unmatched value and benefits to customers across various applications. With advanced technology and innovative design, this small outline package delivers exceptional results with power supplies of 3V and a terminal pitch of just 0.65mm. Experience seamless integration and reliable performance with the PCM3002EG/2K, setting new standards in consumer circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to heat, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount technology saves space on the PCB and allows for automated assembly, improving efficiency.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics, ensuring compatibility and optimal performance.

Minimum Operating Temperature: -25 °C

Can operate in cold environments without any issues, making it versatile for different applications.

Maximum Seated Height: 2 mm

Low profile design allows for compact product designs and efficient use of space.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for consumer electronics.

Maximum Supply Current: 24 mA

Low power consumption helps in energy efficiency and prolonging battery life in portable devices.

Technical Specifications

Other Function Consumer ICs PCM3002EG/2K attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Length:

8.2 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

24 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

PCM3002EG/2K General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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