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PCM3001EG4

Texas Instruments

PCM3001EG4 by Texas Instruments

PCM3001EG4 by Texas Instruments is a consumer IC with 28 terminals, operating at -25 to 85°C. It has a supply voltage range of 4.5-5.5V and consumes up to 50mA current. This CMOS technology chip is ideal for various consumer circuit applications due to its small outline package and surface-mount capability.

Median Price

$5.020

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 188 parts In-Stock

1+ parts

$5.020

100+ parts

$4.920

1k+ parts

$4.820

10k+ parts

-

188

$5.020

$4.920

$4.820

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,132 parts In-Stock

1+ parts

$7.277

100+ parts

-

1k+ parts

-

10k+ parts

-

3,132

$7.277

-

-

-

Vyrian

USA . 2,121 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,121

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 757 parts In-Stock

1+ parts

$2.642

100+ parts

-

1k+ parts

$3.131

10k+ parts

-

757

$2.642

-

$3.131

-

IDEA Electronic Components Group

UK . 2,233 parts In-Stock

1+ parts

$2.968

100+ parts

-

1k+ parts

$2.671

10k+ parts

-

2,233

$2.968

-

$2.671

-

ChromeModa Solutions

Germany . 836 parts In-Stock

1+ parts

$2.968

100+ parts

$2.434

1k+ parts

-

10k+ parts

-

836

$2.968

$2.434

-

-

Corphita

USA . 2,473 parts In-Stock

1+ parts

$6.894

100+ parts

-

1k+ parts

-

10k+ parts

-

2,473

$6.894

-

-

-

Component Stockers USA

USA . 144 parts In-Stock

1+ parts

$7.870

100+ parts

$7.400

1k+ parts

-

10k+ parts

-

144

$7.870

$7.400

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-

Microchip USA

USA . 3,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,969

-

-

-

-

DigiPath Technology Company

USA . 798 parts In-Stock

1+ parts

-

100+ parts

$2.676

1k+ parts

-

10k+ parts

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798

-

$2.676

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-

Perfect Parts

USA . 211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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211

-

-

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Overview

Enhance your consumer electronic devices with the PCM3001EG4 by Texas Instruments, a high-quality consumer IC that offers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this product is designed to meet the demands of various applications in the consumer electronics category. With a package body material of PLASTIC/EPOXY and a surface mount design, this compact and versatile IC is perfect for a wide range of projects. Trust Texas Instruments to deliver cutting-edge technology and exceptional value with the PCM3001EG4, providing customers with the competitive edge they need in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal circuitry, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: RECTANGULAR

Facilitates easier handling and placement of the IC in various electronic devices.

Power Supplies (V): 5

Standard voltage level for compatibility with many electronic systems, ensuring versatility.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, making the IC suitable for a wide range of operating environments.

Technology: CMOS

Consumes low power, making the IC energy efficient and suitable for battery-operated devices.

Technical Specifications

Other Function Consumer ICs PCM3001EG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

PCM3001EG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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