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PCI4512GHK

Texas Instruments

PCI4512GHK by Texas Instruments

PCI4512GHK by Texas Instruments is a 216-terminal bus controller with 32-bit address and external data bus width. It operates at 24.576 MHz clock frequency, supporting a max data transfer rate of 132 MBps. Ideal for PCMCIA applications, it features a low-profile grid array package with a 0.8 mm terminal pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,507 parts In-Stock

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Digiode

USA . 3,092 parts In-Stock

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3,092

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Distributors (Availability)

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AZTECH Wire

Italy . 332 parts In-Stock

1+ parts

$7.874

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332

$7.874

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One Stop Electronics

USA . 514 parts In-Stock

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$23.000

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514

$23.000

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Corohmni

South Africa . 2,627 parts In-Stock

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$24.657

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$24.657

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Parana Technologies

USA . 2,113 parts In-Stock

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$56.361

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2,113

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DigiPath Technology Company

USA . 256 parts In-Stock

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$62.060

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256

$62.060

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ChromeModa Solutions

Germany . 4,055 parts In-Stock

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$63.327

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$51.928

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4,055

$63.327

$51.928

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IDEA Electronic Components Group

UK . 1,157 parts In-Stock

1+ parts

$63.327

100+ parts

$60.161

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$56.994

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$63.327

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$56.994

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Corphita

USA . 2,598 parts In-Stock

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Overview

Enhance your device's performance with the PCI4512GHK from Texas Instruments, a top-tier manufacturer known for producing high-quality bus controllers. Ideal for various applications, this product offers seamless data transfer at a rapid speed of 132 MBps, ensuring efficient connectivity. With a compact square package and low profile design, it's perfect for space-constrained environments. Upgrade your system today with this reliable, high-speed solution that guarantees optimal performance and value for customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and ensures the component is resistant to damage, making it ideal for rugged environments.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on printed circuit boards, saving space and improving manufacturability.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for greater flexibility in power requirements and compatibility with a wider range of systems.

Address Bus Width: 32

Wider address bus width enables the bus controller to handle larger volumes of data and address more memory locations efficiently.

Package Shape: SQUARE

Square package shape simplifies the design and layout of the PCB, optimizing space utilization and improving overall system integration.

No. of Terminals: 216

Higher number of terminals allows for increased connectivity options and functionality, making the bus controller versatile and adaptable to different configurations.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style ensures precise connections and efficient signal transmission, enhancing overall performance and reliability.

Minimum Supply Voltage: 3 V

Low minimum supply voltage helps in minimizing power consumption and extending the battery life of the device, making it energy-efficient.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range allows for reliable operation in harsh environments and ensures the longevity of the bus controller.

Maximum Data Transfer Rate: 132 MBps

High data transfer rate enables fast and efficient communication between devices, reducing latency and improving overall system performance.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable operation even in cold conditions, making the bus controller suitable for a wide range of applications.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and maintenance, and ensures secure connections, minimizing the risk of signal loss or disruptions.

Maximum Seated Height: 1.4 mm

Low maximum seated height allows for compact designs and efficient use of space, making the bus controller suitable for applications with size constraints.

Width: 16 mm

Compact width dimension enables the bus controller to be easily integrated into tight spaces or crowded PCB layouts, ensuring flexibility in system design.

External Data Bus Width: 32

Matching external data bus width with address bus width improves data handling efficiency and ensures seamless communication between components.

Maximum Clock Frequency: 24.576 MHz

High maximum clock frequency allows for fast data processing and real-time operations, making the bus controller suitable for high-performance applications.

Length: 16 mm

Compact length dimension facilitates space-saving installation and layout design, enabling the bus controller to be used in compact or portable devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions and makes the bus controller suitable for commercial applications.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

Specific peripheral IC type indicates the functionality and compatibility of the bus controller with PCMCIA devices, ensuring seamless integration and operation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the bus controller efficient and reliable for various applications.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable signal transmission, ensuring stable performance and minimizing the risk of connection failures.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent power delivery to the bus controller, preventing voltage fluctuations and ensuring reliable operation.

Bus Compatibility: PCI

Compatibility with PCI bus standard enables seamless integration with existing systems and devices, ensuring interoperability and flexibility in system design.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density packaging and efficient use of space, enabling the bus controller to be used in compact and miniaturized devices.

Drive Interface Standard: IEEE1394; IEEE1394A

Support for IEEE1394 and IEEE1394A drive interface standards ensures compatibility with a wide range of devices and peripherals, enhancing connectivity options.

Technical Specifications

Bus Controllers PCI4512GHK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

24.576 MHz

Maximum Data Transfer Rate:

132 MBps

Drive Interface Standard:

IEEE1394; IEEE1394A

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B216

Length:

16 mm

No. of Terminals:

216

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI4512GHK Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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