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PCI4450GJG

Texas Instruments

PCI4450GJG by Texas Instruments

PCI4450GJG by Texas Instruments is a bus controller with 32-bit address and external data bus width. It operates at 33.33 MHz clock frequency, supporting PCI and ISA bus compatibility for IEEE 1394 drive interfaces. This low-profile, fine-pitch package is ideal for PCMCIA applications in commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,680 parts In-Stock

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6,680

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Digiode

USA . 4,946 parts In-Stock

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Cyclops Electronics Ltd

UK . 900 parts In-Stock

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900

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Prism Electronics

USA . 8 parts In-Stock

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8

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Distributors (Availability)

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One Stop Electronics

USA . 293 parts In-Stock

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$14.000

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293

$14.000

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AZTECH Wire

Italy . 266 parts In-Stock

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$16.555

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266

$16.555

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Parana Technologies

USA . 2,290 parts In-Stock

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$25.038

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$25.722

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2,290

$25.038

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$25.722

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DigiPath Technology Company

USA . 1,652 parts In-Stock

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$27.570

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$25.365

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$27.570

$25.365

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ChromeModa Solutions

Germany . 6,545 parts In-Stock

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$28.133

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$23.069

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$28.133

$23.069

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IDEA Electronic Components Group

UK . 977 parts In-Stock

1+ parts

$28.133

100+ parts

$26.726

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$25.320

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977

$28.133

$26.726

$25.320

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Corohmni

South Africa . 844 parts In-Stock

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$75.769

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844

$75.769

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Kepictronics

USA . 6,258 parts In-Stock

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6,258

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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A-Z Elektronik GmbH

Germany . 1,881 parts In-Stock

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Corphita

USA . 1,196 parts In-Stock

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Perfect Parts

USA . 9 parts In-Stock

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Overview

Unlock seamless data transfer and enhanced performance with the PCI4450GJG by Texas Instruments. Crafted with precision using top-quality materials, this bus controller offers unrivaled reliability and efficiency. Perfect for a wide range of applications, this product is designed to meet your needs with ease. Elevate your projects with the superior value, benefits, and advantages that only Texas Instruments can provide. Experience the difference today and take your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus controller, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Allows for efficient power management and operation within the specified voltage range.

Package Shape: SQUARE

Enables easy integration and placement within systems due to its compact and symmetrical design.

Maximum Data Transfer Rate: 132 MBps

Ensures fast and reliable data transfer capabilities, making it ideal for handling high-speed communication tasks.

Terminal Position: BOTTOM

Facilitates easy and secure connection to other components or devices, enhancing the overall reliability of the bus controller.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high performance, contributing to the overall effectiveness of the bus controller.

Bus Compatibility: PCI; ISA

Supports connection to a variety of bus systems, ensuring compatibility with different devices and systems for versatile use.

Technical Specifications

Bus Controllers PCI4450GJG attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

33.33 MHz

Maximum Data Transfer Rate:

132 MBps

Drive Interface Standard:

IEEE 1394

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B257

Length:

16 mm

No. of Terminals:

257

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

PCI4450GJG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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