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PCA9517DRG4

Texas Instruments

PCA9517DRG4 by Texas Instruments

PCA9517DRG4 by Texas Instruments is an 8-terminal IC with a supply voltage range of 2.7V to 5.5V, ideal for industrial applications. It features a BICMOS technology, operates b/w -40°C to 85°C, and has a peak reflow temperature of 260°C. This rectangular-shaped IC is surface mountable and suitable for various interface circuit requirements.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,020 parts In-Stock

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Digiode

USA . 1,920 parts In-Stock

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Prism Electronics

USA . 97 parts In-Stock

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Nova Conductors

Japan . 53 parts In-Stock

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AZTECH Wire

Italy . 558 parts In-Stock

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$6.788

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558

$6.788

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Corohmni

South Africa . 799 parts In-Stock

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$8.083

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Parana Technologies

USA . 1,221 parts In-Stock

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$9.858

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$915.431

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$8.872

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$9.858

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DigiPath Technology Company

USA . 370 parts In-Stock

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$10.854

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370

$10.854

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IDEA Electronic Components Group

UK . 2,043 parts In-Stock

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$11.076

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$10.522

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$9.968

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ChromeModa Solutions

Germany . 1,551 parts In-Stock

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$11.076

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$9.082

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Ampacity Inc.

Singapore . 1,059 parts In-Stock

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$18.500

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One Stop Electronics

USA . 1,540 parts In-Stock

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$19.500

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Semicontronic

India . 299 parts In-Stock

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$31.500

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$30.712

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$30.555

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Continental Prestige Electronics

USA . 5,843 parts In-Stock

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Corphita

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Argo Parts USA

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Microchip USA

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Elevate your electronic designs with the high-quality PCA9517DRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products that exceed expectations. The PCA9517DRG4 falls under the category of Other Function Interface ICs, offering versatile applications for various projects. With its small outline package style and industrial temperature grade, this interface circuit ensures reliable performance in any environment. Trust in Texas Instruments to provide innovative solutions for your design needs. Choose the PCA9517DRG4 for unmatched value, benefits, and advantages that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures the product can withstand various environmental conditions.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

The high supply voltage capability ensures compatibility with a wide range of applications, making it versatile.

Package Shape: RECTANGULAR

The rectangular shape allows for space-efficient placement on a circuit board, maximizing available space for other components.

Power Supplies (V): 3/5

The dual power supply options provide flexibility for different voltage requirements in various systems.

No. of Terminals: 8

The ample number of terminals allow for multiple connections, enhancing the functionality of the product.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the footprint on the circuit board, ideal for compact designs.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability even in extreme conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures functionality in cold environments, making it suitable for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The finish provides corrosion resistance and ensures reliable connections for long-term use.

Terminal Position: DUAL

The dual terminal position allows for flexibility in mounting options, catering to different installation requirements.

Maximum Seated Height: 1.75 mm

The low seated height profile is suitable for compact designs with height constraints.

Width: 3.9 mm

The narrow width profile saves space on the board, enabling dense packing of components for efficient layout.

Maximum Time At Peak Reflow Temperature (s): 30

The quick reflow time ensures efficient soldering during assembly, reducing production time.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures proper soldering for reliable connections.

Length: 4.9 mm

The compact length dimension allows for versatile placement on the board, accommodating various design layouts.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Technology: BICMOS

The BICMOS technology offers a combination of bipolar and CMOS advantages, providing high-performance and low-power benefits.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and enhances mechanical strength for secure connections.

Nominal Supply Voltage: 3 V

The nominal supply voltage ensures compatibility with standard 3V systems, increasing the product's usability.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for close spacing of terminals, which is beneficial for high-density board designs.

Interface IC Type: INTERFACE CIRCUIT

The specialized interface circuit type makes it ideal for facilitating communication between different components in a system.

Technical Specifications

Other Function Interface ICs PCA9517DRG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE 0.9 TO 5.5

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

PCA9517DRG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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