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OPA727AIDGKRG4

Texas Instruments

OPA727AIDGKRG4 by Texas Instruments

OPA727AIDGKRG4 by Texas Instruments is an operational amplifier with a max input offset voltage of 300uV, common mode reject ratio of 100dB, and unity gain bandwidth of 20MHz. Ideal for military-grade applications due to its low-offset and low-bias characteristics, it operates in temperatures ranging from -55°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 11,500 parts In-Stock

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Digiode

USA . 4,701 parts In-Stock

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Vyrian

USA . 2,532 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,914 parts In-Stock

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$1.468

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$2.151

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1,914

$1.468

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$2.151

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ChromeModa Solutions

Germany . 2,472 parts In-Stock

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$1.650

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$1.353

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$1.650

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IDEA Electronic Components Group

UK . 1,324 parts In-Stock

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$1.650

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$1.485

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One Stop Electronics

USA . 1,634 parts In-Stock

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$6.410

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1,634

$6.410

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AZTECH Wire

Italy . 524 parts In-Stock

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$13.222

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524

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Component Stockers USA

USA . 494 parts In-Stock

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$99.990

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494

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Kepictronics

USA . 5,167 parts In-Stock

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Corphita

USA . 4,000 parts In-Stock

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Microchip USA

USA . 2,223 parts In-Stock

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DigiPath Technology Company

USA . 1,622 parts In-Stock

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$1.488

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Perfect Parts

USA . 403 parts In-Stock

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Overview

Discover the cutting-edge OPA727AIDGKRG4 operational amplifier by Texas Instruments, setting new standards in performance and reliability. As a leader in the industry, Texas Instruments guarantees top-quality products that excel in various applications within the operational amplifiers category. With ultra-low input offset voltage and bias current, this op amp ensures precision and efficiency in your designs. Unlock unparalleled value and benefits for your projects with the OPA727AIDGKRG4, delivering unmatched performance and versatility for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the package durable and resistant to external elements, ensuring a longer lifespan for the product.

Maximum Input Offset Voltage: 300 uV

Low input offset voltage ensures minimal errors in signal processing, making this op amp ideal for precision applications.

Maximum Average Bias Current (IIB): 0.0005 uA

Low bias current reduces power consumption and improves battery life, making this op amp energy efficient.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Nominal Common Mode Reject Ratio: 100 dB

High common mode rejection ratio ensures that the op amp can effectively reject noise and interference in the input signal.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this op amp compatible with a wide range of applications and power sources.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows the op amp to perform reliably in harsh environmental conditions.

Technical Specifications

Operational Amplifiers (Op Amps) OPA727AIDGKRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±2/±6/4/12 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

20 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Minimum Common Mode Rejection Ratio (CMRR ):

86 dB

Input Offset Voltage Limit:

300 uV

Minimum Voltage Gain:

63100

Nominal Slew Rate:

30 V/us

Maximum Input Offset Current (IIO):

100 pA

Peak Bias Current:

500 pA

Maximum Bias Current (IIB) @25 °C:

500 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.6 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-6.6 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

6.5 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

OPA727AIDGKRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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