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OPA633KPG4

Texas Instruments

OPA633KPG4 by Texas Instruments

OPA633KPG4 by Texas Instruments is a BUFFER amplifier with 260 MHz bandwidth, 1000 V/us slew rate, and 25000 uV max input offset voltage. It is ideal for precision signal buffering in applications requiring high-speed performance and low distortion levels.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,303 parts In-Stock

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Digiode

USA . 4,707 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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North Shore Components

USA . 6 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 819 parts In-Stock

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$5.410

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819

$5.410

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Ampacity Inc.

Singapore . 273 parts In-Stock

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$5.410

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Parana Technologies

USA . 1,908 parts In-Stock

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$6.123

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$568.632

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$5.511

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$6.123

$568.632

$5.511

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DigiPath Technology Company

USA . 579 parts In-Stock

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$6.742

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579

$6.742

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ChromeModa Solutions

Germany . 569 parts In-Stock

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$6.880

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$5.642

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$6.880

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IDEA Electronic Components Group

UK . 37 parts In-Stock

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$6.880

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$6.192

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AZTECH Wire

Italy . 416 parts In-Stock

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$16.087

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Continental Prestige Electronics

USA . 5,776 parts In-Stock

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Argo Parts USA

USA . 1,764 parts In-Stock

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Corphita

USA . 1,489 parts In-Stock

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Microchip USA

USA . 432 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your audio systems with the high-quality OPA633KPG4 buffer amplifier by Texas Instruments. Designed with precision and reliability in mind, this versatile component is perfect for a wide range of applications, from professional audio equipment to industrial automation. With its superior performance and advanced technology, the OPA633KPG4 ensures optimal signal processing and minimal distortion, providing unmatched value and benefits to customers seeking top-notch amplification solutions. Trust Texas Instruments for innovation that amplifies success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and insulation, making the product suitable for various operating environments.

Maximum Input Offset Voltage: 25000 uV

Ensures accurate output with minimal deviation from the input signal.

Nominal Supply Voltage / Vsup (V): 12

Ideal voltage supply for stable performance of the buffer amplifier.

Minimum Slew Rate: 1000 V/us

Fast signal response time for handling rapid changes in input signals effectively.

Nominal Bandwidth (3dB): 260 MHz

Provides a wide bandwidth for processing high-frequency signals without distortion.

Technology: BIPOLAR

Utilizes bipolar technology for improved signal accuracy and reliability.

Maximum Supply Current: 30 mA

Efficient power usage to ensure optimal performance without excessive power consumption.

Technical Specifications

Buffer Amplifiers OPA633KPG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Power Supply:

±12 V

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

260 MHz

Minimum Slew Rate:

1000 V/us

Nominal Slew Rate:

2500 V/us

Input Offset Voltage Limit:

25 mV

Peak Bias Current:

50 uA

Maximum Bias Current (IIB) @25 °C:

35 uA

Operational Characteristics

Maximum Supply Current:

30 mA

Nominal Supply Voltage:

12 V

Maximum Supply Voltage:

20 V

Nominal Negative Supply Voltage (Vsup):

-12 V

Maximum Negative Supply Voltage:

-20 V

Lowest Output Current:

80 mA

Lowest Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.386 in (9.81 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

DIP

Package Shape:

Package Style:

In-Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

OPA633KPG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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