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OPA633KP

Texas Instruments

OPA633KP by Texas Instruments

OPA633KP by Texas Instruments is a buffer amplifier with a max input offset voltage of 25000 uV, min slew rate of 1000 V/us, and nominal bandwidth of 260 MHz. It is commonly used in applications requiring high-speed signal buffering and amplification.

Median Price

$13.149

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Nova Conductors

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Speed Components Ltd

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Electronic Expediters

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Carlin Systems, Inc.

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Quantum Digital Technology

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One Stop Electronics

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Parana Technologies

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DigiPath Technology Company

USA . 1,262 parts In-Stock

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IDEA Electronic Components Group

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Continental Prestige Electronics

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Bastille Electronics

Australia . 450 parts In-Stock

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AZTECH Wire

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Overview

Texas Instruments presents the OPA633KP, a high-quality buffer amplifier that offers exceptional performance and versatility. Manufactured by Texas Instruments, a renowned leader in semiconductor technology, this amplifier is designed to meet the needs of various applications. With its wide bandwidth of 260 MHz and fast slew rate of 1000 V/us, the OPA633KP ensures accurate signal amplification and precise control. Its compact size and durable plastic/epoxy package make it easy to integrate into any circuitry. Whether you're working on audio systems, precision instruments, or communication equipment, the OPA633KP delivers outstanding value, reliability, and performance. Experience the advantages of Texas Instruments' expertise with the OPA633KP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product features a PLASTIC/EPOXY package body material, which provides durability and protection to the internal components, making it a reliable choice for various applications.

Maximum Input Offset Voltage: 25000 uV

With a low maximum input offset voltage of 25000 uV, this buffer amplifier ensures accurate and precise signal amplification, enhancing the overall performance of the system.

Maximum Average Bias Current (IIB): 50 uA

The maximum average bias current of only 50 uA ensures low power consumption while maintaining optimal signal integrity, making it energy-efficient and suitable for power-sensitive applications.

No. of Functions: 1

This buffer amplifier combines all the necessary functions required for signal buffering in a single unit, simplifying system design and reducing component count, making it a convenient and cost-effective choice.

Package Shape: RECTANGULAR

The rectangular package shape offers space-saving benefits, allowing for efficient PCB utilization and easy integration into compact electronic systems, making it ideal for applications with limited space.

Nominal Supply Voltage / Vsup (V): 12

With a nominal supply voltage of 12V, this buffer amplifier is compatible with standard power supply configurations, ensuring easy integration with existing systems.

Power Supplies (V): +-12

The availability of dual power supplies with a range of ±12V allows for a wide operating voltage range, enabling flexibility in various applications.

No. of Terminals: 8

The presence of 8 terminals offers multiple connection options, allowing for versatile configuration and accommodating various input and output requirements with ease.

Package Style (Meter): IN-LINE

The in-line package style facilitates straightforward installation and connection, making it convenient for field servicing and system maintenance.

Minimum Slew Rate: 1000 V/us

With a minimum slew rate of 1000 V/us, this buffer amplifier delivers fast signal response and high-speed amplification, enabling it to handle rapid changes in input signals effectively.

Maximum Supply Voltage Limit: 20 V

This buffer amplifier is designed with a maximum supply voltage limit of 20V, providing protection against voltage surges and preventing damage to the internal circuitry.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation even in demanding environments with elevated temperature conditions, enhancing the overall product durability.

Maximum Bias Current (IIB) @25C: 35 uA

With a maximum bias current of 35 uA at 25°C, this buffer amplifier exhibits low operational current variation over temperature, ensuring stable and consistent performance in different thermal conditions.

Minimum Operating Temperature: -25 °C

The wide minimum operating temperature range of -25°C allows this buffer amplifier to operate reliably even in extreme cold environments, making it suitable for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The NICKEL PALLADIUM GOLD terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and long-term performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in board layout and enables easy integration into various types of circuit configurations, making it adaptable to different system designs.

Maximum Seated Height: 5.08 mm

With a maximum seated height of 5.08 mm, this buffer amplifier can be easily accommodated within compact spaces, making it suitable for applications with height restrictions.

Width: 7.62 mm

The narrow width of 7.62 mm allows for efficient use of PCB real estate, enabling compact system designs and efficient utilization of available space.

Nominal Bandwidth (3dB): 260 MHz

With a nominal bandwidth of 260 MHz, this buffer amplifier ensures high-speed signal amplification and accurate reproduction of high-frequency components, making it ideal for applications requiring broad frequency response.

Length: 9.81 mm

The compact length of 9.81 mm contributes to the overall space-saving design, allowing for easy integration into small electronic devices or systems.

Maximum Negative Supply Voltage Limit: -20 V

This buffer amplifier is designed to tolerate negative supply voltages up to -20V, providing flexibility in system configurations and ensuring compatibility with various power supply configurations.

Technology: BIPOLAR

The utilization of bipolar technology ensures high linearity, low distortion, and excellent noise performance, making this buffer amplifier suitable for applications requiring precise signal buffering and amplification.

Terminal Form: THROUGH-HOLE

With a through-hole terminal form, this buffer amplifier can be easily mounted onto a PCB through soldering, providing secure and reliable mechanical attachment.

Amplifier Type: BUFFER

Being specifically designed as a buffer amplifier, this product excels in providing impedance matching, signal isolation, and driving capabilities, making it an ideal choice for signal chain applications.

Maximum Supply Current: 30 mA

With a maximum supply current of 30 mA, this buffer amplifier operates within a reasonable power consumption range, ensuring efficient usage of power resources.

Nominal Negative Supply Voltage (Vsup): -12 V

The nominal negative supply voltage of -12V allows for proper biasing and ensures compatibility with various power supply configurations, making it convenient for system integration.

Packing Method: TUBE

This buffer amplifier is supplied in a tube packaging method, providing secure storage and protection during transportation, simplifying inventory management and ensuring product quality.

Nominal Slow Rate: 2500 V/us

The nominal slew rate of 2500 V/us allows for fast signal amplification without sacrificing accuracy, enabling smooth and high-fidelity signal reproduction in various applications.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this buffer amplifier conforms to standard spacing requirements, facilitating easy connection and compatibility with commonly used connectors and sockets.

Minimum Output Current: 0.08 A

The minimum output current of 0.08 A ensures the ability to drive demanding loads and provides sufficient current sourcing capability, making it suitable for applications requiring high-current signal buffering.

Technical Specifications

Buffer Amplifiers OPA633KP attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Power Supply:

±12 V

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

260 MHz

Minimum Slew Rate:

1000 V/us

Nominal Slew Rate:

2500 V/us

Input Offset Voltage Limit:

25 mV

Peak Bias Current:

50 uA

Maximum Bias Current (IIB) @25 °C:

35 uA

Operational Characteristics

Maximum Supply Current:

30 mA

Nominal Supply Voltage:

12 V

Maximum Supply Voltage:

20 V

Nominal Negative Supply Voltage (Vsup):

-12 V

Maximum Negative Supply Voltage:

-20 V

Lowest Output Current:

80 mA

Lowest Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.386 in (9.81 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

DIP

Package Shape:

Package Style:

In-Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

OPA633KP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

NSN

5962-01-383-8292, 5962013838292

NIIN

013838292

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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