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O919A152TRGZRQ1

Texas Instruments

O919A152TRGZRQ1 by Texas Instruments

O919A152TRGZRQ1 by Texas Instruments is a Power Management IC with 48 terminals, operating at -40 to 105°C. It has a max output current of 7A and a switching frequency of 2700 kHz, suitable for industrial applications requiring precise power supply management in compact spaces.

Median Price

$7.767

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,117 parts In-Stock

1+ parts

$7.767

100+ parts

$6.332

1k+ parts

$4.221

10k+ parts

-

10,117

$7.767

$6.332

$4.221

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,894 parts In-Stock

1+ parts

$7.379

100+ parts

-

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1,894

$7.379

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Vyrian

USA . 4,197 parts In-Stock

1+ parts

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4,197

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Elcom Components

USA . 28 parts In-Stock

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-

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28

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,739 parts In-Stock

1+ parts

$6.990

100+ parts

-

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2,739

$6.990

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AZTECH Wire

Italy . 129 parts In-Stock

1+ parts

$10.200

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129

$10.200

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Parana Technologies

USA . 123 parts In-Stock

1+ parts

$21.867

100+ parts

-

1k+ parts

$22.354

10k+ parts

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123

$21.867

-

$22.354

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DigiPath Technology Company

USA . 1,178 parts In-Stock

1+ parts

$24.079

100+ parts

$22.152

1k+ parts

-

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1,178

$24.079

$22.152

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ChromeModa Solutions

Germany . 3,243 parts In-Stock

1+ parts

$24.570

100+ parts

$20.147

1k+ parts

-

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3,243

$24.570

$20.147

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IDEA Electronic Components Group

UK . 1,060 parts In-Stock

1+ parts

$24.570

100+ parts

$23.342

1k+ parts

$22.113

10k+ parts

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1,060

$24.570

$23.342

$22.113

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Overview

Unleash the power of cutting-edge technology with the O919A152TRGZRQ1 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled performance and reliability in a compact package. Ideal for industrial applications, this chip carrier boasts a wide temperature range and high switching frequency, making it a versatile solution for all your power supply management needs. Experience the seamless integration and superior efficiency that Texas Instruments is renowned for, and elevate your projects to new heights with the O919A152TRGZRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the internal components of the power management IC, ensuring durability and long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 3.8 V

The specified nominal supply voltage ensures compatibility with a wide range of power sources, making this power management IC versatile and adaptable.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this power management IC can withstand demanding operating conditions and maintain stable performance under heat stress.

No. of Outputs: 8

Having multiple outputs allows for efficient power distribution to various components or subsystems, increasing the flexibility and functionality of the overall system.

Technical Specifications

Power Management ICs O919A152TRGZRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

8

No. of Functions:

1

No. of Outputs:

8

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

2700 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

O919A152TRGZRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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