Loading...

O3853QDCATQ1

Texas Instruments

O3853QDCATQ1 by Texas Instruments

O3853QDCATQ1 by Texas Instruments is a Power Management IC with AEC-Q100 screening for automotive applications. It features a 48-terminal small outline package, operating temperature range of -40 to 125°C, and output voltage range of 6V. Ideal for power supply management circuits in automotive systems requiring high reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,149

-

-

-

-

Digiode

USA . 1,123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,123

-

-

-

-

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

700

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,385 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,385

$1.500

$1.462

$1.455

-

One Stop Electronics

USA . 1,152 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,152

$2.500

-

-

-

Ampacity Inc.

Singapore . 960 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

960

$2.500

-

-

-

AZTECH Wire

Italy . 266 parts In-Stock

1+ parts

$14.697

100+ parts

-

1k+ parts

-

10k+ parts

-

266

$14.697

-

-

-

Corohmni

South Africa . 174 parts In-Stock

1+ parts

$14.788

100+ parts

-

1k+ parts

-

10k+ parts

-

174

$14.788

-

-

-

Parana Technologies

USA . 2,100 parts In-Stock

1+ parts

$21.898

100+ parts

-

1k+ parts

$22.391

10k+ parts

-

2,100

$21.898

-

$22.391

-

ChromeModa Solutions

Germany . 5,581 parts In-Stock

1+ parts

$24.604

100+ parts

$20.175

1k+ parts

-

10k+ parts

-

5,581

$24.604

$20.175

-

-

IDEA Electronic Components Group

UK . 1,208 parts In-Stock

1+ parts

$24.604

100+ parts

$23.374

1k+ parts

$22.144

10k+ parts

-

1,208

$24.604

$23.374

$22.144

-

Corphita

USA . 4,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,154

-

-

-

-

Microchip USA

USA . 2,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,405

-

-

-

-

DigiPath Technology Company

USA . 2,097 parts In-Stock

1+ parts

-

100+ parts

$22.183

1k+ parts

-

10k+ parts

-

2,097

-

$22.183

-

-

Argo Parts USA

USA . 1,130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,130

-

-

-

-

Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

700

-

-

-

-

Continental Prestige Electronics

USA . 614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

614

-

-

-

-

Bastille Electronics

Australia . 39 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

39

-

-

-

-

Overview

Experience the exceptional quality and reliability of Texas Instruments with the O3853QDCATQ1 Power Management IC. Designed for automotive applications, this small outline, heat sink package offers a wide operating temperature range and dual terminal position for maximum flexibility. With a minimum output voltage of 6V and maximum output current of 1A, this IC provides efficient power supply management while ensuring high performance in challenging environments. Trust Texas Instruments to deliver industry-leading solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the Power Management IC, ensuring a longer lifespan.

Surface Mount YES

Being surface mountable makes installation of the Power Management IC easier and more efficient, saving time and effort during assembly.

Screening Level AEC-Q100

The AEC-Q100 screening level indicates that this Power Management IC meets stringent automotive quality standards, ensuring reliability in harsh automotive environments.

Package Shape RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board, enabling a compact design for the overall system.

No. of Terminals 48

Having 48 terminals provides flexibility in connecting the Power Management IC to various components in the system, allowing for versatile applications.

Package Style (Meter) SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The small outline, heat sink/slug, thin profile, and shrink pitch package style enhances thermal performance, reduces space requirements, and improves overall efficiency of the Power Management IC.

Maximum Operating Temperature 125 °C

With a maximum operating temperature of 125°C, this Power Management IC can perform reliably in high temperature environments, making it suitable for automotive applications.

Minimum Output Voltage 6 V

The minimum output voltage of 6 V ensures compatibility with components that require a higher voltage supply, enhancing the versatility of the Power Management IC.

Minimum Operating Temperature -40 °C

The minimum operating temperature of -40°C allows the Power Management IC to function effectively in cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance of the Power Management IC.

Maximum Output Voltage 6 V

The maximum output voltage of 6 V meets the power requirements of various components in the system, delivering stable and consistent power supply.

Terminal Position DUAL

Having dual terminal positions enhances the flexibility of installation and connection options for the Power Management IC, accommodating different circuit board layouts and design constraints.

Maximum Seated Height 1.2 mm

The maximum seated height of 1.2 mm allows for a low profile design, facilitating space-saving integration of the Power Management IC in compact electronic devices.

Width (mm) 6.1 mm

With a width of 6.1 mm, this Power Management IC offers a compact form factor, making it suitable for applications where space is limited.

Other IC type POWER SUPPLY MANAGEMENT CIRCUIT

Being a Power Supply Management Circuit, this IC provides efficient power distribution, voltage regulation, and protection functions, contributing to the overall reliability and performance of the system.

Minimum Supply Voltage (Vsup) 7 V

The minimum supply voltage of 7 V ensures a stable power input for the Power Management IC to operate effectively, providing consistent performance in various operating conditions.

Maximum Time At Peak Reflow Temperature (s) 30

With a maximum time of 30 seconds at peak reflow temperature, the Power Management IC can withstand the reflow soldering process during assembly, ensuring reliable solder connections.

Peak Reflow Temperature °C 260

The peak reflow temperature of 260°C indicates the thermal robustness of the Power Management IC, allowing it to endure the solder reflow process without damage.

Length 12.5 mm

With a length of 12.5 mm, this Power Management IC offers a compact size for easy integration into electronic systems with limited space constraints.

Temperature Grade AUTOMOTIVE

Having an automotive temperature grade indicates that this Power Management IC is designed to operate reliably in automotive applications, ensuring performance in harsh environmental conditions.

Maximum Output Current 1 A

The maximum output current of 1 A allows the Power Management IC to deliver sufficient power to components in the system, supporting their operational requirements.

Terminal Form GULL WING

The gull wing terminal form facilitates easy soldering and ensures secure connections, contributing to the reliability and durability of the Power Management IC in the circuit.

Terminal Pitch 0.5 mm

With a terminal pitch of 0.5 mm, this Power Management IC offers precise and compact terminal spacing, enabling efficient connections and layout on the circuit board.

Moisture Sensitivity Level (MSL) 3

The moisture sensitivity level of 3 indicates the robustness of the Power Management IC against moisture during storage and assembly, ensuring reliability in various environments.

Maximum Supply Voltage (Vsup) 36 V

The maximum supply voltage of 36 V provides flexibility for different power input requirements, making this Power Management IC suitable for a wide range of applications.

Technical Specifications

Power Management ICs O3853QDCATQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Maximum Output Voltage:

6 V

Minimum Output Voltage:

6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6.1 mm

Trade Compliance

O3853QDCATQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 7