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NE556D3

Texas Instruments

NE556D3 by Texas Instruments

NE556D3 by Texas Instruments is a 14-terminal analog waveform generator with power supplies of 5/15V. Its small outline package and dual terminal position make it ideal for commercial applications requiring bipolar technology. With operating temperatures ranging from 0 to 70°C, this surface-mount device is suitable for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,006 parts In-Stock

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6,006

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Digiode

USA . 1,948 parts In-Stock

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1,948

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,585 parts In-Stock

1+ parts

$2.500

100+ parts

-

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1,585

$2.500

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Semicontronic

India . 1,341 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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1,341

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 1,205 parts In-Stock

1+ parts

$4.500

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1,205

$4.500

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AZTECH Wire

Italy . 607 parts In-Stock

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$5.936

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607

$5.936

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Parana Technologies

USA . 1,114 parts In-Stock

1+ parts

$17.616

100+ parts

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$17.805

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1,114

$17.616

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$17.805

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ChromeModa Solutions

Germany . 3,332 parts In-Stock

1+ parts

$19.793

100+ parts

$16.230

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3,332

$19.793

$16.230

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IDEA Electronic Components Group

UK . 2,090 parts In-Stock

1+ parts

$19.793

100+ parts

$18.803

1k+ parts

$17.814

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2,090

$19.793

$18.803

$17.814

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Corphita

USA . 3,745 parts In-Stock

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3,745

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DigiPath Technology Company

USA . 453 parts In-Stock

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$17.845

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453

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$17.845

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Corohmni

South Africa . 78 parts In-Stock

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78

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Overview

Unlock endless possibilities with the NE556D3 by Texas Instruments, a high-quality analog waveform generation device that offers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this product is designed to meet the demands of various applications in the electronics industry. Whether you're creating audio circuits, timing circuits, or voltage-controlled oscillators, the NE556D3 delivers exceptional value, precision, and versatility. Trust Texas Instruments to provide you with cutting-edge technology that empowers your projects to reach new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps in reducing the overall weight of the product, making it easier to handle and install.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and simplifying assembly processes.

Power Supplies (V): 5/15

The product can operate with a range of power supplies, providing flexibility in various applications where different voltage levels are required.

No. of Terminals: 14

The higher number of terminals allows for more connections and functionalities to be supported, enhancing the versatility of the product.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space on the circuit board, enabling compact designs and efficient use of board real estate.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the product can withstand and perform reliably in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can function effectively even in colder environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

Having dual terminal positions provides redundancy and flexibility in connecting the product, ensuring reliable signal transmission and ease of installation.

Technology: BIPOLAR

The use of bipolar technology allows for precise waveform generation and stable performance, making the product ideal for applications requiring accurate signal processing.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and mounting onto circuit boards, ensuring secure connections and reliable performance.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting on PCBs, enabling more components to be placed in a limited space and enhancing overall circuit efficiency.

Technical Specifications

Analog Waveform Generation NE556D3 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

NE556D3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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