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MSP430G2855IDA38

Texas Instruments

MSP430G2855IDA38 by Texas Instruments

MSP430G2855IDA38 by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 12-Ch 10-Bit ADC channels, and 3 timers. It operates at a max clock frequency of 16 MHz and has low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing and connectivity via I2C, IRDA, LIN, SPI(2), UART interfaces.

Median Price

$3.636

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,670 parts In-Stock

1+ parts

$3.636

100+ parts

$3.186

1k+ parts

$1.800

10k+ parts

-

1,670

$3.636

$3.186

$1.800

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,329 parts In-Stock

1+ parts

$3.454

100+ parts

-

1k+ parts

-

10k+ parts

-

3,329

$3.454

-

-

-

Vyrian

USA . 4,997 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,997

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,644 parts In-Stock

1+ parts

$3.272

100+ parts

-

1k+ parts

-

10k+ parts

-

1,644

$3.272

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-

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AZTECH Wire

Italy . 157 parts In-Stock

1+ parts

$9.080

100+ parts

-

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10k+ parts

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157

$9.080

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Microchip USA

USA . 2,921 parts In-Stock

1+ parts

$23.040

100+ parts

$22.900

1k+ parts

$22.830

10k+ parts

$22.760

2,921

$23.040

$22.900

$22.830

$22.760

Parana Technologies

USA . 2,247 parts In-Stock

1+ parts

$32.132

100+ parts

-

1k+ parts

$98.995

10k+ parts

-

2,247

$32.132

-

$98.995

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DigiPath Technology Company

USA . 795 parts In-Stock

1+ parts

$35.381

100+ parts

-

1k+ parts

-

10k+ parts

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795

$35.381

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IDEA Electronic Components Group

UK . 1,624 parts In-Stock

1+ parts

$36.103

100+ parts

$34.298

1k+ parts

$32.493

10k+ parts

-

1,624

$36.103

$34.298

$32.493

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ChromeModa Solutions

Germany . 1,312 parts In-Stock

1+ parts

$36.103

100+ parts

$29.604

1k+ parts

-

10k+ parts

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1,312

$36.103

$29.604

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Perfect Parts

USA . 2,509 parts In-Stock

1+ parts

-

100+ parts

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2,509

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Component Stockers USA

USA . 1,981 parts In-Stock

1+ parts

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100+ parts

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1,981

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Overview

Unlock the power of innovation with the MSP430G2855IDA38 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers cutting-edge solutions for a wide range of applications. With its compact design and high performance capabilities, this microcontroller offers unmatched value and benefits to customers. Whether you're working on IoT devices, industrial automation, or consumer electronics, the MSP430G2855IDA38 provides the reliability and efficiency you need to bring your ideas to life. Experience the quality and advantages of Texas Instruments with the MSP430G2855IDA38.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the microcontroller, making it durable and resistant to external factors.

Surface Mount: YES

Allows for easy installation and soldering onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage inputs, making it versatile and compatible with different power sources.

On Chip Data RAM Width: 8

Provides a decent amount of memory for storing data and variables, useful for various applications.

Package Shape: RECTANGULAR

Standard shape that fits well on circuit boards, optimizing space and layout.

Bit Size: 16

Higher bit size allows for more complex calculations and operations, suitable for advanced applications.

Power Supplies (V): 2/3.3

Supports multiple power supply options, giving flexibility in design and compatibility with different systems.

No. of Terminals: 38

Sufficient terminals for connecting to various peripherals and components, enhancing the microcontroller's functionality.

Minimum Supply Voltage: 3.3 V

Low minimum supply voltage helps in reducing power consumption and increasing efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in diverse environmental conditions without performance issues.

Technical Specifications

Microcontrollers MSP430G2855IDA38 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

38

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.45 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), POR, PWM, TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430G2855IDA38 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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