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MSP430FR69891IPN

Texas Instruments

MSP430FR69891IPN by Texas Instruments

MSP430FR69891IPN by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 12 ADC channels, and 20 timers. Ideal for industrial applications, it operates b/w -40 to 85°C with low power mode and offers connectivity through I2C, IRDA, SPI, UART interfaces.

Median Price

$6.843

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,432 parts In-Stock

1+ parts

$6.843

100+ parts

$5.579

1k+ parts

$3.719

10k+ parts

-

3,432

$6.843

$5.579

$3.719

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,547 parts In-Stock

1+ parts

$6.501

100+ parts

-

1k+ parts

-

10k+ parts

-

2,547

$6.501

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$6.860

100+ parts

-

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-

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150

$6.860

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-

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Vyrian

USA . 8,150 parts In-Stock

1+ parts

-

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-

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8,150

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,319 parts In-Stock

1+ parts

$5.820

100+ parts

-

1k+ parts

-

10k+ parts

-

3,319

$5.820

-

-

-

Corphita

USA . 3,112 parts In-Stock

1+ parts

$6.159

100+ parts

-

1k+ parts

-

10k+ parts

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3,112

$6.159

-

-

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Corohmni

South Africa . 255 parts In-Stock

1+ parts

$6.860

100+ parts

-

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255

$6.860

-

-

-

Continental Prestige Electronics

USA . 6,865 parts In-Stock

1+ parts

$6.860

100+ parts

-

1k+ parts

-

10k+ parts

$6.723

6,865

$6.860

-

-

$6.723

Advanced Electronics

New Zealand . 31 parts In-Stock

1+ parts

$6.997

100+ parts

$6.997

1k+ parts

$6.997

10k+ parts

-

31

$6.997

$6.997

$6.997

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Semicontronic

India . 3,003 parts In-Stock

1+ parts

$12.660

100+ parts

$12.344

1k+ parts

$12.280

10k+ parts

-

3,003

$12.660

$12.344

$12.280

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AZTECH Wire

Italy . 728 parts In-Stock

1+ parts

$14.120

100+ parts

-

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728

$14.120

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Parana Technologies

USA . 550 parts In-Stock

1+ parts

$75.819

100+ parts

-

1k+ parts

-

10k+ parts

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550

$75.819

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ChromeModa Solutions

Germany . 6,545 parts In-Stock

1+ parts

$85.190

100+ parts

$69.856

1k+ parts

-

10k+ parts

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6,545

$85.190

$69.856

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IDEA Electronic Components Group

UK . 1,832 parts In-Stock

1+ parts

$85.190

100+ parts

$80.930

1k+ parts

$76.671

10k+ parts

-

1,832

$85.190

$80.930

$76.671

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DigiPath Technology Company

USA . 1,255 parts In-Stock

1+ parts

-

100+ parts

$76.807

1k+ parts

-

10k+ parts

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1,255

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$76.807

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Argo Parts USA

USA . 1,026 parts In-Stock

1+ parts

-

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1,026

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FR69891IPN microcontroller! Crafted by industry leaders, this cutting-edge device offers unparalleled quality and reliability. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller delivers exceptional performance and efficiency. Experience the value of seamless connectivity, advanced peripherals, and low power consumption. Elevate your projects with the Texas Instruments MSP430FR69891IPN microcontroller - the ultimate solution for your next groundbreaking creation.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and protection for the microcontroller, making it long-lasting.

Surface Mount

YES - Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage

3.6 V - Provides flexibility in power supply options, accommodating a wide range of applications.

On Chip Data RAM Width

8 - Enables efficient data processing and storage, enhancing the microcontroller's performance capabilities.

Package Shape

SQUARE - Optimizes space utilization on the circuit board, ideal for compact designs.

Bit Size

16 - Offers high computing power and processing capabilities for complex tasks.

No. of Terminals

80 - Provides ample connection points for interfacing with various components, increasing versatility.

Package Style (Meter)

FLATPACK, LOW PROFILE, FINE PITCH - Facilitates a streamlined and space-efficient design for compact electronic devices.

Minimum Supply Voltage

1.8 V - Allows for operation in low-power environments, making it energy-efficient.

Maximum Operating Temperature

85 °C - Ensures reliable performance in a wide range of operating conditions.

CPU Family

MSP430 - Known for its low power consumption and high performance, offering a reliable solution for embedded systems.

Minimum Operating Temperature

40 °C - Suitable for harsh environmental conditions, ensuring the microcontroller's reliability in extreme temperatures.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - Provides excellent conductivity and corrosion resistance for reliable data transmission.

ADC Channels

YES - Enables analog-to-digital conversion for sensor interfacing, expanding the microcontroller's capabilities.

DMA Channels

YES - Supports direct memory access for efficient data transfer, enhancing overall system performance.

Technical Specifications

Microcontrollers MSP430FR69891IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

3

No. of Terminals:

80

No. of Timers:

20

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(20), WDT"

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR69891IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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