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MSP430FR6977IPZ

Texas Instruments

MSP430FR6977IPZ by Texas Instruments

MSP430FR6977IPZ by Texas Instruments is a 16-bit microcontroller with 16 external interrupts, 2048 bytes of RAM, and 16 MHz clock frequency. Ideal for industrial applications requiring low power consumption, it features FRAM ROM programmability, 16-channel ADCs, and connectivity via EUSCI interfaces.

Median Price

$4.057

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,566 parts In-Stock

1+ parts

$4.057

100+ parts

$3.308

1k+ parts

$2.205

10k+ parts

-

7,566

$4.057

$3.308

$2.205

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,589 parts In-Stock

1+ parts

$3.854

100+ parts

-

1k+ parts

-

10k+ parts

-

3,589

$3.854

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-

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Vyrian

USA . 6,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,224

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,603 parts In-Stock

1+ parts

$3.651

100+ parts

-

1k+ parts

-

10k+ parts

-

1,603

$3.651

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-

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AZTECH Wire

Italy . 418 parts In-Stock

1+ parts

$18.540

100+ parts

-

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418

$18.540

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Microchip USA

USA . 1,340 parts In-Stock

1+ parts

$26.780

100+ parts

$26.620

1k+ parts

$26.530

10k+ parts

$26.450

1,340

$26.780

$26.620

$26.530

$26.450

Parana Technologies

USA . 1,178 parts In-Stock

1+ parts

$58.765

100+ parts

-

1k+ parts

-

10k+ parts

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1,178

$58.765

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DigiPath Technology Company

USA . 1,731 parts In-Stock

1+ parts

$64.707

100+ parts

$59.531

1k+ parts

-

10k+ parts

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1,731

$64.707

$59.531

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IDEA Electronic Components Group

UK . 917 parts In-Stock

1+ parts

$66.028

100+ parts

$62.727

1k+ parts

$59.425

10k+ parts

-

917

$66.028

$62.727

$59.425

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ChromeModa Solutions

Germany . 128 parts In-Stock

1+ parts

$66.028

100+ parts

$54.143

1k+ parts

-

10k+ parts

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128

$66.028

$54.143

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Overview

Experience the cutting-edge technology of the MSP430FR6977IPZ from Texas Instruments, a leader in microcontroller innovation. This versatile device offers endless possibilities in various applications, providing customers with unparalleled value and benefits. With its advanced features and high-quality design, this microcontroller is the perfect choice for those seeking reliability, efficiency, and performance. Upgrade your projects today with the MSP430FR6977IPZ and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Ease of installation and compact design for space-saving.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Bit Size: 16

Offers a good balance between performance and cost for many applications.

No. of Terminals: 100

Sufficient number of terminals for connecting to external components.

Minimum Supply Voltage: 1.8 V

Allows for operation in low power situations.

CPU Family: MSP430

Known for low power consumption and high performance.

No. of External Interrupts: 16

Enables the microcontroller to respond to external events efficiently.

ADC Channels: YES

Enables analog to digital conversion for sensor integration.

DMA Channels: YES

Improves data transfer efficiency and frees up CPU for other tasks.

ROM Words: 65536

Sufficient program memory for storing code and data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient execution of instructions.

RAM Bytes: 2048

Sufficient RAM for data storage and manipulation.

Technology: CMOS

Low power consumption and high noise immunity.

Analog To Digital Convertors: 16-Ch 12-Bit

High-resolution ADC for accurate analog signal conversion.

PWM Channels: YES

Enables precise control of output signals.

Connectivity: EUSCI(4)

Versatile communication interface options for connecting to other devices.

ROM Programmability: FRAM

Fast and non-volatile program memory.

No. of I/O Lines: 83

Sufficient number of input/output lines for connecting to external components.

Technical Specifications

Microcontrollers MSP430FR6977IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

83

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), LCD, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR6977IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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