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MSP430FR69271IPM

Texas Instruments

MSP430FR69271IPM by Texas Instruments

MSP430FR69271IPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 16 MHz. It features FRAM ROM programmability, 8-Ch 12-Bit ADC channels, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,149 parts In-Stock

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3,149

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Digiode

USA . 171 parts In-Stock

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171

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 617 parts In-Stock

1+ parts

$2.000

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-

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617

$2.000

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AZTECH Wire

Italy . 539 parts In-Stock

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$6.483

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539

$6.483

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Microchip USA

USA . 1,996 parts In-Stock

1+ parts

$29.280

100+ parts

$29.100

1k+ parts

$29.010

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$28.920

1,996

$29.280

$29.100

$29.010

$28.920

Parana Technologies

USA . 1,585 parts In-Stock

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$29.545

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$60.600

10k+ parts

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1,585

$29.545

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$60.600

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ChromeModa Solutions

Germany . 2,817 parts In-Stock

1+ parts

$33.197

100+ parts

$27.222

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2,817

$33.197

$27.222

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IDEA Electronic Components Group

UK . 13 parts In-Stock

1+ parts

$33.197

100+ parts

$31.537

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$29.877

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13

$33.197

$31.537

$29.877

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Corphita

USA . 4,550 parts In-Stock

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4,550

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DigiPath Technology Company

USA . 991 parts In-Stock

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$29.930

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991

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$29.930

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FR69271IPM microcontroller. Designed with cutting-edge technology and precision, this device offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional performance and efficiency. Embrace the future of technology with the MSP430FR69271IPM and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensure durability and resistance to external factors, making the product suitable for various environments.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

No. of External Interrupts: 16

With 16 external interrupts, the microcontroller can efficiently handle external events and respond to them promptly.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient processing and faster execution of instructions, making the microcontroller suitable for high-performance applications.

RAM Bytes: 2048

With 2048 bytes of RAM, the microcontroller can efficiently store and access data during operation, enhancing its performance.

Connectivity: I2C, IRDA, SPI(2), UART

Multiple connectivity options such as I2C, IRDA, SPI, and UART enable easy communication with other devices and peripherals.

Technical Specifications

Microcontrollers MSP430FR69271IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

ANALOG COMPARATOR, BOR, CRC, DMA, LCD, RTC, TIMER

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR69271IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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