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MSP430FR6870IPMR

Texas Instruments

MSP430FR6870IPMR by Texas Instruments

MSP430FR6870IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 8-channel ADC, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$6.536

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 157,500 parts In-Stock

1+ parts

$2.981

100+ parts

$2.430

1k+ parts

$1.620

10k+ parts

-

157,500

$2.981

$2.430

$1.620

-

Adafruit Industries

USA . 350 parts In-Stock

1+ parts

$10.091

100+ parts

$9.183

1k+ parts

$8.275

10k+ parts

-

350

$10.091

$9.183

$8.275

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,045 parts In-Stock

1+ parts

$2.832

100+ parts

-

1k+ parts

-

10k+ parts

-

4,045

$2.832

-

-

-

Vyrian

USA . 5,955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,955

-

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 78,745 parts In-Stock

1+ parts

$2.530

100+ parts

-

1k+ parts

-

10k+ parts

-

78,745

$2.530

-

-

-

Corphita

USA . 3,795 parts In-Stock

1+ parts

$2.683

100+ parts

-

1k+ parts

-

10k+ parts

-

3,795

$2.683

-

-

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$10.091

100+ parts

$9.183

1k+ parts

$8.275

10k+ parts

-

350

$10.091

$9.183

$8.275

-

AZTECH Wire

Italy . 608 parts In-Stock

1+ parts

$20.410

100+ parts

-

1k+ parts

-

10k+ parts

-

608

$20.410

-

-

-

Parana Technologies

USA . 972 parts In-Stock

1+ parts

$22.466

100+ parts

-

1k+ parts

$23.134

10k+ parts

-

972

$22.466

-

$23.134

-

DigiPath Technology Company

USA . 2,355 parts In-Stock

1+ parts

$24.738

100+ parts

-

1k+ parts

-

10k+ parts

-

2,355

$24.738

-

-

-

IDEA Electronic Components Group

UK . 2,133 parts In-Stock

1+ parts

$25.243

100+ parts

$23.981

1k+ parts

$22.719

10k+ parts

-

2,133

$25.243

$23.981

$22.719

-

ChromeModa Solutions

Germany . 549 parts In-Stock

1+ parts

$25.243

100+ parts

$20.699

1k+ parts

-

10k+ parts

-

549

$25.243

$20.699

-

-

Component Stockers USA

USA . 44,404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.760

10k+ parts

$1.760

44,404

-

-

$1.760

$1.760

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430FR6870IPMR microcontroller. From a trusted manufacturer known for quality, this device offers unmatched value and benefits for a variety of applications. With low power modes, advanced peripherals, and cutting-edge technology, this microcontroller is designed to help you bring your projects to life efficiently and effectively. Discover the possibilities with the MSP430FR6870IPMR and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltage options, providing flexibility in power requirements.

Bit Size: 16

Offers a good balance between processing power and complexity for various applications.

ADC Channels: YES

Enables analog-to-digital conversion capabilities, essential for interfacing with sensors and other analog components.

RAM Bytes: 2048

Provides sufficient memory for data storage and manipulation, enabling efficient program execution.

Maximum Clock Frequency: 24 MHz

Supports high-speed processing tasks, making the microcontroller suitable for applications that require quick data processing.

Connectivity: IRDA, I2C, SPI(2), UART

Offers multiple communication interfaces, allowing the microcontroller to easily interact with other devices and systems.

Technical Specifications

Microcontrollers MSP430FR6870IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6870IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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