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MSP430FR59891IRGCR

Texas Instruments

MSP430FR59891IRGCR by Texas Instruments

MSP430FR59891IRGCR by Texas Instruments is a 16-bit microcontroller with a max clock frequency of 24 MHz. It features 64 terminals, ADC and DMA channels, and ROM programmability. This microcontroller is commonly used in industrial applications due to its temperature grade and moisture sensitivity level.

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Digiode

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Vyrian

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Nova Conductors

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One Stop Electronics

USA . 171 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 483 parts In-Stock

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Parana Technologies

USA . 929 parts In-Stock

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Ampacity Inc.

Singapore . 1,589 parts In-Stock

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Semicontronic

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$24.375

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$24.250

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DigiPath Technology Company

USA . 1,776 parts In-Stock

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ChromeModa Solutions

Germany . 2,825 parts In-Stock

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IDEA Electronic Components Group

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Advanced Electronics

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Corphita

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Overview

Experience the next level of microcontroller technology with the MSP430FR59891IRGCR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in every product they create. The MSP430FR59891IRGCR offers unparalleled performance and versatility, making it the perfect choice for a wide range of applications. With its advanced features like ADC channels and DMA channels, this microcontroller enables seamless integration and efficient data processing. Its compact size and low power consumption make it ideal for space-constrained projects. Unlock endless possibilities with the MSP430FR59891IRGCR and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability of this microcontroller allows for easy and efficient installation onto circuit boards, saving valuable space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle a wide range of power sources, providing flexibility and compatibility with different systems.

Package Shape: SQUARE

The square package shape offers a compact design, allowing for efficient use of board space and facilitating integration into various electronic devices.

Bit Size: 16

The 16-bit architecture of this microcontroller enables higher processing capacity and improved performance, making it suitable for demanding applications that require advanced computing capabilities.

No. of Terminals: 64

With 64 terminals available, this microcontroller offers a sufficient number of I/O connections for connecting to peripherals and external devices, enhancing its versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style with heat sink/slug and a very thin profile allows for efficient heat dissipation, making this microcontroller suitable for high-power applications that require effective thermal management.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage of 1.8 V ensures compatibility with low-power systems, offering energy efficiency and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand elevated temperatures, making it suitable for industrial applications that may be subjected to harsh environments.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate reliably in extremely low temperatures as low as -40°C makes it suitable for outdoor and automotive applications, where resilience to cold conditions is required.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance, ensuring reliable and long-lasting connections, making this microcontroller ideal for applications that require high reliability in demanding environments.

ADC Channels: YES

The availability of ADC (Analog-to-Digital Converter) channels allows the microcontroller to interface with analog sensors or signals, enabling precise measurement and control in applications such as temperature sensing and audio processing.

DMA Channels: YES

The presence of DMA (Direct Memory Access) channels enhances the microcontroller's data transfer capabilities, enabling fast and efficient transfer of data between internal and external devices, making it suitable for high-speed data processing applications.

Terminal Position: QUAD

The quad terminal position facilitates easier PCB layout and soldering, simplifying the assembly process and reducing manufacturing costs.

ROM Words: 131072

With a ROM capacity of 131072 words, this microcontroller provides ample space for storing program instructions and data, accommodating complex applications that require a large amount of code storage.

Maximum Seated Height: 1 mm

The microcontroller's low maximum seated height of 1 mm allows for slim and compact designs, making it suitable for space-constrained applications where size is critical.

Width: 9 mm

With a width of 9 mm, this microcontroller offers a compact form factor, allowing for efficient space utilization in circuit board design.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency of 24 MHz enables fast execution of instructions and efficient processing of data, making this microcontroller suitable for applications that require high-speed operation.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand the peak reflow temperature for a maximum duration of 30 seconds during the manufacturing process, ensuring high-quality soldering and reliable connections.

Peak Reflow Temperature °C: 260

The microcontroller's peak reflow temperature of 260°C ensures proper soldering and component attachment during the assembly process, guaranteeing the reliability and longevity of the product.

Length: 9 mm

With a length of 9 mm, this microcontroller offers a compact size, facilitating design flexibility and allowing for space-saving integration into various electronic systems.

Temperature Grade: INDUSTRIAL

The microcontroller's industrial temperature grade designation certifies its ability to withstand rugged operating conditions and extreme temperature ranges, making it suitable for robust industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller's RISC (Reduced Instruction Set Computing) architecture provides enhanced efficiency and streamlined performance, making it ideal for applications that require fast data processing and efficient resource utilization.

Technology: CMOS

Built using CMOS (Complementary Metal-Oxide-Semiconductor) technology, this microcontroller offers low power consumption, high noise immunity, and reliable performance, making it suitable for battery-operated devices and noise-sensitive applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly and rework processes, allowing for easy and efficient integration into printed circuit boards, reducing manufacturing costs and improving production yield.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3 V, this microcontroller supports compatibility with standard power sources, ensuring ease of integration and widespread applicability.

PWM Channels: YES

The availability of PWM (Pulse-Width Modulation) channels allows the microcontroller to generate precise analog output signals, enabling applications such as motor control and LED dimming with high accuracy and flexibility.

ROM Programmability: FLASH

The microcontroller's flash programmability enables in-system programming and flexibility in updating firmware, simplifying development and facilitating future enhancements or bug fixes.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this microcontroller offers compatibility with fine-pitch PCB designs, allowing for high-density integration and enabling miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 3

The microcontroller's MSL 3 designation indicates its ability to withstand moderate levels of moisture exposure, offering reliability and robustness in varied operating environments.

Speed: 16 rpm

The microcontroller's speed of 16 revolutions per minute enables precise control and efficient operation in applications such as robotic systems or motor-driven devices, ensuring accurate motion and reliable performance.

No. of I/O Lines: 48

With 48 I/O lines, this microcontroller provides ample connections for interfacing with external devices, enabling versatile input/output capabilities and allowing for the control of numerous peripherals and sensors.

Technical Specifications

Microcontrollers MSP430FR59891IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

MSP430FR59891IRGCR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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