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MSP430FR5857IRHAR

Texas Instruments

MSP430FR5857IRHAR by Texas Instruments

MSP430FR5857IRHAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It features 16 ADC channels, 15 timers, and operates at a max frequency of 16 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$2.782

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,722 parts In-Stock

1+ parts

$2.782

100+ parts

$2.268

1k+ parts

$1.512

10k+ parts

-

3,722

$2.782

$2.268

$1.512

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Adafruit Industries

USA . 500 parts In-Stock

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-

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500

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Digiode

USA . 1,852 parts In-Stock

1+ parts

$2.643

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1,852

$2.643

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Vyrian

USA . 3,041 parts In-Stock

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3,041

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Ampacity Inc.

Singapore . 2,045 parts In-Stock

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$2.360

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2,045

$2.360

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Semicontronic

India . 1,758 parts In-Stock

1+ parts

$2.360

100+ parts

$2.301

1k+ parts

$2.289

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1,758

$2.360

$2.301

$2.289

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Corphita

USA . 3,349 parts In-Stock

1+ parts

$2.504

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3,349

$2.504

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AZTECH Wire

Italy . 851 parts In-Stock

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$19.320

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851

$19.320

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Corohmni

South Africa . 479 parts In-Stock

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$29.491

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479

$29.491

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Parana Technologies

USA . 840 parts In-Stock

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$59.993

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840

$59.993

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DigiPath Technology Company

USA . 339 parts In-Stock

1+ parts

$66.060

100+ parts

$60.775

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339

$66.060

$60.775

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IDEA Electronic Components Group

UK . 1,582 parts In-Stock

1+ parts

$67.408

100+ parts

$64.038

1k+ parts

$60.667

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1,582

$67.408

$64.038

$60.667

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ChromeModa Solutions

Germany . 19 parts In-Stock

1+ parts

$67.408

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$55.275

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19

$67.408

$55.275

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Continental Prestige Electronics

USA . 5,862 parts In-Stock

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5,862

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Component Stockers USA

USA . 2,577 parts In-Stock

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$1.640

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2,577

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$1.640

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Advanced Electronics

New Zealand . 500 parts In-Stock

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500

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Argo Parts USA

USA . 177 parts In-Stock

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177

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Overview

Unlock the potential of your next project with the MSP430FR5857IRHAR by Texas Instruments, a versatile microcontroller designed to meet the highest industry standards. With a focus on quality and innovation, Texas Instruments delivers a product that exceeds expectations in terms of performance and reliability. Ideal for a wide range of applications, this microcontroller offers customers unmatched value through its low power consumption, advanced peripherals, and cutting-edge technology. Experience the benefits of seamless connectivity, efficient power management, and robust design with the MSP430FR5857IRHAR, setting a new standard for excellence in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring its longevity and reliability in various operating conditions.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, making it compatible with a wide range of applications.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with existing designs and software, making it easier to integrate into projects.

Analog To Digital Convertors: 16-Ch 12-Bit

Enables precise analog-to-digital conversion, making it suitable for applications that require accurate sensor data acquisition.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient data processing and control, enhancing overall performance.

Connectivity: I2C, IRDA, SPI(1), UART, USCI(3)

Offers multiple communication interfaces for easy integration with other devices and systems, providing versatility in connectivity options.

Low Power Mode: YES

Supports low power consumption, making it ideal for battery-operated or energy-efficient applications.

Technical Specifications

Microcontrollers MSP430FR5857IRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR5857IRHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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