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MSP430F6637IZQWR

Texas Instruments

MSP430F6637IZQWR by Texas Instruments

MSP430F6637IZQWR by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 32MHz max clock frequency, and 74 I/O lines. Ideal for industrial applications, it features DAC and ADC channels, ROM programmability via flash, and DMA support for efficient data transfer.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,470 parts In-Stock

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6,470

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Digiode

USA . 2,269 parts In-Stock

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2,269

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Distributors (Availability)

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One Stop Electronics

USA . 175 parts In-Stock

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$11.000

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175

$11.000

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AZTECH Wire

Italy . 803 parts In-Stock

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$12.247

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803

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Parana Technologies

USA . 1,445 parts In-Stock

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$72.146

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$72.146

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ChromeModa Solutions

Germany . 3,696 parts In-Stock

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$81.063

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$66.472

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3,696

$81.063

$66.472

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IDEA Electronic Components Group

UK . 376 parts In-Stock

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$81.063

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$77.010

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$72.957

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376

$81.063

$77.010

$72.957

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Corphita

USA . 1,316 parts In-Stock

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DigiPath Technology Company

USA . 801 parts In-Stock

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$73.086

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Microchip USA

USA . 215 parts In-Stock

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Overview

Discover the power and precision of the Texas Instruments MSP430F6637IZQWR microcontroller, a top-of-the-line product from a trusted manufacturer. With a wide range of applications in various industries, this microcontroller offers unparalleled value and benefits to customers seeking high-quality performance and reliability. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F6637IZQWR delivers cutting-edge technology, efficient power management, and advanced features to help you bring your projects to life. Invest in the best with Texas Instruments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the microcontroller, ensuring reliable performance and durability.

Surface Mount: YES

Surface mount packaging allows for easy and compact integration of the microcontroller onto PCBs, saving space and enhancing design flexibility.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with various power supply configurations, providing flexibility in system design.

Package Shape: SQUARE

Square shape helps in uniform distribution of components on the PCB, optimizing space and enhancing thermal performance.

Bit Size: 16

16-bit architecture offers higher precision and performance compared to lower-bit microcontrollers, making it suitable for more complex applications.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog sensors and actuators, expanding its functionality.

Power Supplies (V): 2/3.3

Supports multiple voltage supply options, allowing for compatibility with various components and systems.

No. of Terminals: 113

A higher number of terminals provide more connectivity options, enabling the microcontroller to interface with a wide range of external devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This packaging style offers a compact form factor with high terminal density, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.4 V

Provides a lower operating voltage option, which can be beneficial for power-sensitive applications and energy-efficient designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

Microcontrollers MSP430F6637IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

113

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSP430F6637IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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