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MSP430F5631IPZR

Texas Instruments

MSP430F5631IPZR by Texas Instruments

MSP430F5631IPZR by Texas Instruments is a 16-bit microcontroller with 196608 ROM words and 18432 RAM bytes. It operates at a max clock frequency of 32 MHz, making it suitable for industrial applications requiring high-speed processing. With various peripherals like BOR, DMA, and RTC, it offers versatile connectivity options including I2C, SPI, UART, and USB for efficient data transfer.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,596 parts In-Stock

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Digiode

USA . 4,081 parts In-Stock

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4,081

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Distributors (Availability)

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AZTECH Wire

Italy . 333 parts In-Stock

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$11.745

100+ parts

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333

$11.745

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Microchip USA

USA . 497 parts In-Stock

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$29.480

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$29.300

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$29.210

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$29.110

497

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$29.210

$29.110

One Stop Electronics

USA . 972 parts In-Stock

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$31.000

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972

$31.000

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$31.335

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$31.022

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$29.769

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100

$31.335

$31.022

$29.769

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Parana Technologies

USA . 1,832 parts In-Stock

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$64.788

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1,832

$64.788

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ChromeModa Solutions

Germany . 4,346 parts In-Stock

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$72.796

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$59.693

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$72.796

$59.693

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IDEA Electronic Components Group

UK . 2,028 parts In-Stock

1+ parts

$72.796

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$69.156

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$65.516

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2,028

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$65.516

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Corphita

USA . 4,595 parts In-Stock

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DigiPath Technology Company

USA . 352 parts In-Stock

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$65.633

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352

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$65.633

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Overview

Experience the power of innovation with the MSP430F5631IPZR microcontroller by Texas Instruments. Designed with cutting-edge technology and top-quality materials, this device offers unmatched performance and reliability for a wide range of applications. Whether you're working on IoT devices, consumer electronics, or industrial automation, this microcontroller provides seamless connectivity and efficient processing. Trust in the Texas Instruments legacy of excellence and unlock endless possibilities with the MSP430F5631IPZR. Elevate your projects to new heights with this industry-leading solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a range of other components.

Bit Size: 16

Offers a good balance between performance and cost for general-purpose microcontroller applications.

No. of Terminals: 100

Provides ample connectivity options for interfacing with external devices and peripherals.

CPU Family: MSP430

Belongs to a well-established and widely used CPU family known for its energy efficiency and robust performance.

Maximum Clock Frequency: 32 MHz

Enables fast processing speeds for demanding applications while also conserving power when operating at lower frequencies.

RAM Bytes: 18432

Sufficient memory capacity for storing and manipulating data during program execution, ensuring smooth operation.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

Offers a versatile set of communication interfaces for connecting to various external devices and networks.

Technical Specifications

Microcontrollers MSP430F5631IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Trade Compliance

MSP430F5631IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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