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MSP430F5504IRGZT

Texas Instruments

MSP430F5504IRGZT by Texas Instruments

MSP430F5504IRGZT by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 4KB RAM. It operates at up to 32MHz, has 18 timers, and offers low power modes for industrial applications. With ADC, DMA, PWM channels, and various connectivity options like I2C and UART, it's ideal for embedded systems requiring high performance in a compact form factor.

Median Price

$3.112

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 250 parts In-Stock

1+ parts

$2.705

100+ parts

$2.370

1k+ parts

$1.339

10k+ parts

-

250

$2.705

$2.370

$1.339

-

DigiKey

USA . 225 parts In-Stock

1+ parts

$3.520

100+ parts

$2.194

1k+ parts

$2.080

10k+ parts

-

225

$3.520

$2.194

$2.080

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,415 parts In-Stock

1+ parts

$2.570

100+ parts

-

1k+ parts

-

10k+ parts

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1,415

$2.570

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Vyrian

USA . 1,905 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,905

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 250 parts In-Stock

1+ parts

$2.300

100+ parts

-

1k+ parts

-

10k+ parts

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250

$2.300

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-

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Corphita

USA . 1,088 parts In-Stock

1+ parts

$2.434

100+ parts

-

1k+ parts

-

10k+ parts

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1,088

$2.434

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-

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Parana Technologies

USA . 145 parts In-Stock

1+ parts

$61.345

100+ parts

-

1k+ parts

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145

$61.345

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-

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DigiPath Technology Company

USA . 644 parts In-Stock

1+ parts

$67.548

100+ parts

-

1k+ parts

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10k+ parts

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644

$67.548

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ChromeModa Solutions

Germany . 2,091 parts In-Stock

1+ parts

$68.927

100+ parts

$56.520

1k+ parts

-

10k+ parts

-

2,091

$68.927

$56.520

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IDEA Electronic Components Group

UK . 479 parts In-Stock

1+ parts

$68.927

100+ parts

$65.481

1k+ parts

$62.034

10k+ parts

-

479

$68.927

$65.481

$62.034

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A-Z Elektronik GmbH

Germany . 1,500 parts In-Stock

1+ parts

-

100+ parts

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1,500

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Overview

Unleash the power of innovation with the MSP430F5504IRGZT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that excel in various applications. This versatile product offers unmatched value and benefits, providing customers with reliable performance and cutting-edge features. Whether you're looking to optimize power efficiency, enhance connectivity, or streamline your design process, the MSP430F5504IRGZT is the perfect solution for all your needs. Experience the difference with Texas Instruments and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability and cost-effectiveness.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand a wide range of environmental conditions.

ADC Channels: YES

The presence of analog to digital converter channels allows for accurate measurement of analog signals, making this microcontroller versatile for various applications.

ROM Words: 8192

The large ROM capacity enables storing a significant amount of program data, making this microcontroller suitable for complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being based on Reduced Instruction Set Computing (RISC) architecture, this microcontroller provides enhanced performance and efficiency in executing instructions.

Maximum Clock Frequency: 32 MHz

The high clock frequency allows for fast processing speed, making this microcontroller ideal for tasks that require quick response times.

Connectivity: I2C, IRDA, LIN, SPI, UART, USCI(2)

The multiple connectivity options enable seamless communication with other devices, expanding the functionality of this microcontroller.

Technical Specifications

Microcontrollers MSP430F5504IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

31

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"COMPARATOR, CRC, DMA(3),RTC, TIMER(18), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F5504IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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