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MSP430F2101TDWR

Texas Instruments

MSP430F2101TDWR by Texas Instruments

MSP430F2101TDWR by Texas Instruments is a 16-bit microcontroller with 1024 ROM words, 128 RAM bytes, and 16 MHz clock frequency. Ideal for industrial applications requiring low power consumption, it features peripherals like BOD, comparator(8), timer(16), and WDT.

Median Price

$1.458

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,950 parts In-Stock

1+ parts

$1.458

100+ parts

$1.204

1k+ parts

$0.651

10k+ parts

-

7,950

$1.458

$1.204

$0.651

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 7 parts In-Stock

1+ parts

$0.647

100+ parts

-

1k+ parts

-

10k+ parts

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7

$0.647

-

-

-

Digiode

USA . 2,071 parts In-Stock

1+ parts

$1.385

100+ parts

-

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-

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2,071

$1.385

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Vyrian

USA . 8,761 parts In-Stock

1+ parts

-

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8,761

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,177 parts In-Stock

1+ parts

$1.312

100+ parts

-

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-

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2,177

$1.312

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-

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Parana Technologies

USA . 840 parts In-Stock

1+ parts

$15.381

100+ parts

-

1k+ parts

$15.768

10k+ parts

-

840

$15.381

-

$15.768

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AZTECH Wire

Italy . 119 parts In-Stock

1+ parts

$16.380

100+ parts

-

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119

$16.380

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DigiPath Technology Company

USA . 961 parts In-Stock

1+ parts

$16.936

100+ parts

$15.581

1k+ parts

-

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961

$16.936

$15.581

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IDEA Electronic Components Group

UK . 2,267 parts In-Stock

1+ parts

$17.282

100+ parts

$16.418

1k+ parts

$15.554

10k+ parts

-

2,267

$17.282

$16.418

$15.554

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ChromeModa Solutions

Germany . 1,257 parts In-Stock

1+ parts

$17.282

100+ parts

$14.171

1k+ parts

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1,257

$17.282

$14.171

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Microchip USA

USA . 9,449 parts In-Stock

1+ parts

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9,449

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Overview

Unleash the power of innovation with the MSP430F2101TDWR by Texas Instruments, a top-notch microcontroller designed to revolutionize your projects. With its cutting-edge technology and high-quality manufacturing, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller provides exceptional value and benefits to customers looking for efficient and effective solutions. Upgrade your designs and maximize your potential with the MSP430F2101TDWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications without adding unnecessary weight.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in power supply options for the microcontroller.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with other MSP430 products and tools, allowing for easy integration and development.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture within the microcontroller allows for efficient and fast processing, enhancing overall performance.

Maximum Clock Frequency: 16 MHz

With a high clock frequency, the microcontroller can handle tasks quickly and efficiently, making it suitable for applications that require high-speed processing.

Technical Specifications

Microcontrollers MSP430F2101TDWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2101TDWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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