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MSP430F2101IDGVR

Texas Instruments

MSP430F2101IDGVR by Texas Instruments

MSP430F2101IDGVR by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like PWM channels, ADC channels, and multiple timers, it offers versatile functionality in a compact package ideal for embedded systems.

Median Price

$1.332

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,500 parts In-Stock

1+ parts

$1.402

100+ parts

$1.158

1k+ parts

$0.626

10k+ parts

-

9,500

$1.402

$1.158

$0.626

-

Rochester

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.010

10k+ parts

$0.903

42,000

-

$1.220

$1.010

$0.903

DigiKey

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.530

10k+ parts

-

42,000

-

-

$1.530

-

Verical

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.262

10k+ parts

$1.129

36,000

-

-

$1.262

$1.129

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,364 parts In-Stock

1+ parts

$0.826

100+ parts

-

1k+ parts

-

10k+ parts

-

4,364

$0.826

-

-

-

DigiKey Marketplace

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

$1.010

1k+ parts

-

10k+ parts

-

42,000

-

$1.010

-

-

Vyrian

USA . 2,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,070

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,926 parts In-Stock

1+ parts

$0.782

100+ parts

-

1k+ parts

-

10k+ parts

-

4,926

$0.782

-

-

-

Microchip USA

USA . 1,578 parts In-Stock

1+ parts

$5.548

100+ parts

-

1k+ parts

-

10k+ parts

-

1,578

$5.548

-

-

-

Parana Technologies

USA . 38 parts In-Stock

1+ parts

$70.458

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$70.458

-

-

-

DigiPath Technology Company

USA . 984 parts In-Stock

1+ parts

$77.583

100+ parts

$71.376

1k+ parts

-

10k+ parts

-

984

$77.583

$71.376

-

-

ChromeModa Solutions

Germany . 6,762 parts In-Stock

1+ parts

$79.166

100+ parts

$64.916

1k+ parts

-

10k+ parts

-

6,762

$79.166

$64.916

-

-

IDEA Electronic Components Group

UK . 2,250 parts In-Stock

1+ parts

$79.166

100+ parts

$75.208

1k+ parts

$71.249

10k+ parts

-

2,250

$79.166

$75.208

$71.249

-

Overview

Experience the cutting-edge technology of the MSP430F2101IDGVR by Texas Instruments, a high-quality microcontroller designed to meet your specific needs. With Texas Instruments' reputation for excellence in manufacturing, this product offers reliability and performance you can trust. Ideal for a wide range of applications, this microcontroller provides value and benefits that go beyond the competition. Discover the advantages of the MSP430F2101IDGVR today and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package, ensuring protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in powering the microcontroller.

Bit Size: 16

16-bit architecture allows for more complex operations and calculations to be performed efficiently.

ADC Channels: YES

Built-in analog-to-digital converter channels enable the microcontroller to interface with analog sensors or inputs.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and quick updates to the microcontroller's firmware.

Speed: 16 rpm

Operates at a high speed of 16 MHz, providing fast processing capabilities for real-time applications.

Low Power Mode: YES

Includes low power mode functionality, ideal for energy-efficient applications and battery-powered devices.

Technical Specifications

Microcontrollers MSP430F2101IDGVR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2101IDGVR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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