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MSP430F1222IDW

Texas Instruments

MSP430F1222IDW by Texas Instruments

MSP430F1222IDW by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring low power consumption. Features include 5-Ch 10-Bit ADC channels, SPI and UART connectivity, and peripherals like BOR and timers.

Median Price

$5.836

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,455 parts In-Stock

1+ parts

$4.973

100+ parts

$4.358

1k+ parts

$2.462

10k+ parts

-

3,455

$4.973

$4.358

$2.462

-

Mouser Electronics

USA . 40 parts In-Stock

1+ parts

$6.700

100+ parts

$5.550

1k+ parts

$4.730

10k+ parts

-

40

$6.700

$5.550

$4.730

-

DigiKey

USA . 4 parts In-Stock

1+ parts

$6.700

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$6.700

-

-

-

Rochester

USA . 29 parts In-Stock

1+ parts

-

100+ parts

$3.540

1k+ parts

$3.170

10k+ parts

$2.980

29

-

$3.540

$3.170

$2.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,086 parts In-Stock

1+ parts

$3.249

100+ parts

-

1k+ parts

-

10k+ parts

-

1,086

$3.249

-

-

-

Inventory MP

USA . 5,007 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,007

-

-

-

-

Bristol Electronics

USA . 5,007 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,007

-

-

-

-

Vyrian

USA . 4,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,799

-

-

-

-

Sunrise Surplus Inc.

USA . 125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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125

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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17

-

-

-

-

LWI Electronics Inc

India . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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14

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,780 parts In-Stock

1+ parts

$3.078

100+ parts

-

1k+ parts

-

10k+ parts

-

2,780

$3.078

-

-

-

Microchip USA

USA . 1,493 parts In-Stock

1+ parts

$27.630

100+ parts

$27.460

1k+ parts

$27.370

10k+ parts

$27.290

1,493

$27.630

$27.460

$27.370

$27.290

Parana Technologies

USA . 1,877 parts In-Stock

1+ parts

$55.060

100+ parts

$5,113.142

1k+ parts

$49.554

10k+ parts

-

1,877

$55.060

$5,113.142

$49.554

-

DigiPath Technology Company

USA . 2,048 parts In-Stock

1+ parts

$60.628

100+ parts

-

1k+ parts

-

10k+ parts

-

2,048

$60.628

-

-

-

ChromeModa Solutions

Germany . 4,262 parts In-Stock

1+ parts

$61.865

100+ parts

$50.729

1k+ parts

-

10k+ parts

-

4,262

$61.865

$50.729

-

-

IDEA Electronic Components Group

UK . 778 parts In-Stock

1+ parts

$61.865

100+ parts

$58.772

1k+ parts

$55.678

10k+ parts

-

778

$61.865

$58.772

$55.678

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,000

-

-

-

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Perfect Parts

USA . 5,375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,375

-

-

-

-

Assy Fe

Spain . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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20

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-

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430F1222IDW Microcontroller. Designed for superior performance and reliability, this innovative product is perfect for a wide range of applications. From automotive to industrial automation, this small yet powerful device offers unmatched value and benefits to customers. Experience seamless connectivity, low power consumption, and advanced features that will take your projects to the next level. Choose Texas Instruments for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable electronic devices.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options, making the product versatile.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making the microcontroller energy-efficient and reliable.

ADC Channels: YES

Having Analog to Digital Converters (ADC) channels enables the microcontroller to read analog signals and convert them to digital data, expanding its functionality.

ROM Programmability: FLASH

The ability to program the Read-Only Memory (ROM) with FLASH technology allows for easy and quick updates, enhancing the product's flexibility.

Connectivity: "SPI, UART(2)

Support for Serial Peripheral Interface (SPI) and Universal Asynchronous Receiver-Transmitter (UART) communication protocols enables seamless connectivity with other devices, making it suitable for a wide range of applications.

Technical Specifications

Microcontrollers MSP430F1222IDW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

22

No. of Serial I/Os:

0

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Peripheral IC Type:

Connectivity:

"SPI, UART(2)"

Peripherals:

"BOR, TIMER(3), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F1222IDW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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