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MSP430BQ1010IRTVT

Texas Instruments

MSP430BQ1010IRTVT by Texas Instruments

MSP430BQ1010IRTVT by Texas Instruments is a Power Management IC with 32 terminals, operating at 3V. It features a package style of CHIP CARRIER and can withstand temperatures from -40 to 85°C. Ideal for industrial applications requiring power supply support circuits.

Median Price

$4.100

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 214 parts In-Stock

1+ parts

$4.100

100+ parts

$3.088

1k+ parts

$2.753

10k+ parts

$2.578

214

$4.100

$3.088

$2.753

$2.578

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,680 parts In-Stock

1+ parts

$2.556

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-

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4,680

$2.556

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Vyrian

USA . 6,322 parts In-Stock

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6,322

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Euro-Tech

UK . 250 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 203 parts In-Stock

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203

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Bristol Electronics

USA . 203 parts In-Stock

1+ parts

-

100+ parts

$1.878

1k+ parts

$1.744

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203

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$1.878

$1.744

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Dan-Mar Components

USA . 203 parts In-Stock

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203

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Semi Source

USA . 21 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,030 parts In-Stock

1+ parts

$1.494

100+ parts

-

1k+ parts

$2.165

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2,030

$1.494

-

$2.165

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IDEA Electronic Components Group

UK . 1,788 parts In-Stock

1+ parts

$1.679

100+ parts

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1k+ parts

$1.511

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1,788

$1.679

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$1.511

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ChromeModa Solutions

Germany . 1,000 parts In-Stock

1+ parts

$1.679

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$1.377

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1,000

$1.679

$1.377

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Corphita

USA . 139 parts In-Stock

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$2.421

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139

$2.421

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Component Stockers USA

USA . 128 parts In-Stock

1+ parts

$2.610

100+ parts

$2.210

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128

$2.610

$2.210

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DigiPath Technology Company

USA . 1,401 parts In-Stock

1+ parts

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$1.514

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1,401

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$1.514

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 768 parts In-Stock

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768

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Microchip USA

USA . 401 parts In-Stock

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401

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Overview

Unlock the potential of your power management systems with the MSP430BQ1010IRTVT by Texas Instruments. Crafted from high-quality plastic/epoxy materials, this power supply support circuit offers unparalleled reliability and performance in industrial applications. With a compact square chip carrier package style and quad terminal position, this IC is designed to optimize space and efficiency. Experience the seamless integration of advanced technology and precision engineering, delivering a superior power management solution that exceeds expectations. Trust Texas Instruments for cutting-edge innovation and elevate your power management systems to new heights.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

This material is durable and cost-effective, making the product long-lasting and affordable.

Surface Mount - YES

Allows for easy and efficient installation on PCBs, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup) - 3 V

Compatible with a wide range of applications that require a 3V power supply.

Maximum Operating Temperature - 85 °C

Can operate effectively in high-temperature environments, increasing the product's versatility.

Terminal Finish - NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Temperature Grade - INDUSTRIAL

Suitable for industrial applications, demonstrating the product's robustness and reliability.

Technical Specifications

Power Management ICs MSP430BQ1010IRTVT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTOR THRESHOLD VOLTAGE IS 1.44V

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

MSP430BQ1010IRTVT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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