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MSP430BQ1010IRHBT

Texas Instruments

MSP430BQ1010IRHBT by Texas Instruments

MSP430BQ1010IRHBT by Texas Instruments is a Power Management IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.8-3.6V and nominal threshold voltage of +1.44V, suitable for industrial applications requiring power supply support circuits in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,831 parts In-Stock

1+ parts

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7,831

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Digiode

USA . 1,738 parts In-Stock

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1,738

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 140 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

$2.175

10k+ parts

-

140

$1.510

-

$2.175

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IDEA Electronic Components Group

UK . 1,440 parts In-Stock

1+ parts

$1.697

100+ parts

-

1k+ parts

$1.527

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-

1,440

$1.697

-

$1.527

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ChromeModa Solutions

Germany . 1,052 parts In-Stock

1+ parts

$1.697

100+ parts

$1.392

1k+ parts

-

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1,052

$1.697

$1.392

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One Stop Electronics

USA . 211 parts In-Stock

1+ parts

$2.500

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211

$2.500

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Semicontronic

India . 1,225 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

1,225

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 430 parts In-Stock

1+ parts

$7.500

100+ parts

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430

$7.500

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AZTECH Wire

Italy . 274 parts In-Stock

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$15.259

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274

$15.259

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Corphita

USA . 2,412 parts In-Stock

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2,412

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DigiPath Technology Company

USA . 1,825 parts In-Stock

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100+ parts

$1.530

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1,825

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$1.530

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Corohmni

South Africa . 487 parts In-Stock

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487

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Overview

Unlock the power of efficient and reliable power management with the Texas Instruments MSP430BQ1010IRHBT. Designed to meet industrial standards, this Power Management IC offers unmatched quality and performance. Perfect for a wide range of applications, this chip carrier is the ultimate solution for your power supply support circuit needs. Embrace cutting-edge technology and elevate your projects with the trusted brand that is Texas Instruments. Experience the value and benefits of seamless power management with the MSP430BQ1010IRHBT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, ideal for portable or consumer electronic devices.

Surface Mount: YES

Being surface mountable simplifies the PCB assembly process, saving time and effort during production.

Nominal Supply Voltage (Vsup): 3 V

A stable 3V supply voltage ensures consistent performance of the power management IC in various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand elevated temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this IC suitable for use in extreme cold conditions.

Technical Specifications

Power Management ICs MSP430BQ1010IRHBT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTOR THRESHOLD VOLTAGE IS 1.44V

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+1.44V

Width (mm):

5 mm

Trade Compliance

MSP430BQ1010IRHBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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