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LP873200RHDRQ1

Texas Instruments

LP873200RHDRQ1 by Texas Instruments

LP873200RHDRQ1 by Texas Instruments is a 28-terminal Power Management IC with 4 channels, supporting a max output current of 2A. Operating at -40 to 125 °C, it features a control mode of CURRENT-MODE and switcher config as BUCK. Ideal for automotive applications due to its compact size and high switching frequency of 2200 kHz.

Median Price

$2.343

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 50,000 parts In-Stock

1+ parts

$2.343

100+ parts

$2.053

1k+ parts

$1.160

10k+ parts

-

50,000

$2.343

$2.053

$1.160

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,846 parts In-Stock

1+ parts

$2.226

100+ parts

-

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1,846

$2.226

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Vyrian

USA . 4,664 parts In-Stock

1+ parts

-

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4,664

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Greenchips

USA . 150 parts In-Stock

1+ parts

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150

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SIE Connect GmbH - GreenChips

Germany . 150 parts In-Stock

1+ parts

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,118 parts In-Stock

1+ parts

$2.109

100+ parts

-

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2,118

$2.109

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AZTECH Wire

Italy . 411 parts In-Stock

1+ parts

$16.920

100+ parts

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411

$16.920

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Parana Technologies

USA . 1,029 parts In-Stock

1+ parts

$20.525

100+ parts

-

1k+ parts

$20.599

10k+ parts

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1,029

$20.525

-

$20.599

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DigiPath Technology Company

USA . 243 parts In-Stock

1+ parts

$22.601

100+ parts

$20.793

1k+ parts

-

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243

$22.601

$20.793

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IDEA Electronic Components Group

UK . 1,993 parts In-Stock

1+ parts

$23.062

100+ parts

$21.909

1k+ parts

$20.756

10k+ parts

-

1,993

$23.062

$21.909

$20.756

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ChromeModa Solutions

Germany . 380 parts In-Stock

1+ parts

$23.062

100+ parts

$18.911

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380

$23.062

$18.911

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Lixinc

USA . 16,264 parts In-Stock

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16,264

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A-Z Elektronik GmbH

Germany . 2,900 parts In-Stock

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2,900

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Overview

Enhance your automotive power management system with the LP873200RHDRQ1 by Texas Instruments. Designed with precision and expertise, this Power Management IC offers unrivaled quality and reliability. With a package body material of plastic/epoxy and a square shape, this chip carrier with heat sink/slug is perfect for applications in the automotive industry. Benefit from its current-mode control technique and pulse width modulation to optimize performance. Trust Texas Instruments to deliver cutting-edge technology that ensures efficiency and stability in your power supply support circuit. Elevate your system with the LP873200RHDRQ1 and experience superior power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it a good choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.7 V

The 3.7V nominal supply voltage allows for compatibility with a wide range of devices, making this product versatile and usable in various applications.

No. of Terminals: 28

With 28 terminals, this power management IC offers multiple connection points for enhanced functionality and flexibility in circuit design.

Control Mode: CURRENT-MODE

Current-mode control allows for precise regulation and efficient power management, ensuring optimal performance and energy efficiency.

Maximum Output Current: 2 A

The high maximum output current of 2A enables this IC to power a variety of components or systems, making it suitable for demanding applications.

Technical Specifications

Power Management ICs LP873200RHDRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.8 V

Nominal Input Voltage:

3.7 V

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Outputs:

4

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Maximum Output Voltage:

3.36 V

Minimum Output Voltage:

.7 V

Nominal Output Voltage:

1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.7 V

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2200 kHz

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

LP873200RHDRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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