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LP3972SQE-I514/NOPB

Texas Instruments

LP3972SQE-I514/NOPB by Texas Instruments

LP3972SQE-I514/NOPB by Texas Instruments is a Power Management IC with 3/5 V supplies, 40 terminals, and adjustable threshold. It is used in industrial applications for power supply support circuits due to its CMOS technology and wide operating temperature range of -40 to 85°C.

Median Price

$3.920

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 250 parts In-Stock

1+ parts

$3.920

100+ parts

$3.840

1k+ parts

$3.760

10k+ parts

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250

$3.920

$3.840

$3.760

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,101 parts In-Stock

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5,101

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Digiode

USA . 649 parts In-Stock

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649

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Distributors (Availability)

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Vigor

Singapore . 250 parts In-Stock

1+ parts

$3.270

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250

$3.270

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Ampacity Inc.

Singapore . 1,085 parts In-Stock

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$3.500

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1,085

$3.500

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Semicontronic

India . 732 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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732

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 1,045 parts In-Stock

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$7.500

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1,045

$7.500

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Parana Technologies

USA . 2,226 parts In-Stock

1+ parts

$15.096

100+ parts

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$15.506

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2,226

$15.096

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$15.506

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AZTECH Wire

Italy . 204 parts In-Stock

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$16.072

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204

$16.072

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DigiPath Technology Company

USA . 1,008 parts In-Stock

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$16.623

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$16.623

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ChromeModa Solutions

Germany . 2,781 parts In-Stock

1+ parts

$16.962

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$13.909

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2,781

$16.962

$13.909

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IDEA Electronic Components Group

UK . 1,904 parts In-Stock

1+ parts

$16.962

100+ parts

$16.114

1k+ parts

$15.266

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1,904

$16.962

$16.114

$15.266

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Component Stockers USA

USA . 707 parts In-Stock

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$99.990

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707

$99.990

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Corphita

USA . 1,418 parts In-Stock

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Corohmni

South Africa . 379 parts In-Stock

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Kepictronics

USA . 250 parts In-Stock

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250

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Microchip USA

USA . 202 parts In-Stock

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202

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Overview

Experience unparalleled quality and reliability with the LP3972SQE-I514/NOPB by Texas Instruments, a leading manufacturer in the Power Management ICs category. This surface-mount chip carrier boasts a very thin profile and a wide temperature range, making it perfect for industrial applications. With adjustable threshold and multiple channels, this power supply support circuit offers customers unmatched flexibility and efficiency. Trust Texas Instruments to provide innovative solutions that meet your power management needs. Choose the LP3972SQE-I514/NOPB for superior performance and lasting value.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to mount on a circuit board, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal operating voltage for efficient power management and performance.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of these package styles ensures good heat dissipation and compact size for integration in tight spaces.

Maximum Operating Temperature: 85 °C

Capable of operating under high temperature environments without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient power management.

Adjustable Threshold: YES

Allows for customization of operating thresholds, providing flexibility in power management settings.

Technical Specifications

Power Management ICs LP3972SQE-I514/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.2SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

LP3972SQE-I514/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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